KMPC8270ZQMIBA

IC MPU MPC82XX 266MHZ PBGA516
Part Description

PowerPC G2_LE Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 516-PBGA (27x27)

Quantity 50 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8270
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2_LEDevice Package516-PBGA (27x27)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case516-BBGARAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package516-PBGA (27×27)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of KMPC8270ZQMIBA – IC MPU MPC82XX 266MHZ PBGA516

The KMPC8270ZQMIBA is a PowerPC G2_LE-based microprocessor for embedded applications in the MPC8270 series. It delivers a 32‑bit, single-core processor running at 266 MHz with integrated communications and memory controller features targeted at embedded and consumer networking designs.

Designed for systems that require on-chip communications peripherals and standard memory interfaces, this device combines a PowerPC core with dedicated communications co‑processing, multiple 10/100 Ethernet ports, and USB 2.0 connectivity to simplify system integration and reduce BOM complexity.

Key Features

  • Core  PowerPC G2_LE core; single 32‑bit processing core operating at 266 MHz.
  • Core Microarchitecture  Series-level hardware includes a dual‑issue integer G2_LE implementation with separate 16 KB instruction and 16 KB data caches.
  • I/O Voltage  3.3 V I/O signaling for common embedded interfaces.
  • Co‑processors  Communications and RISC CPM co‑processors to offload protocol and communications tasks.
  • Memory Controllers  On‑chip DRAM and SDRAM controller support for system memory interfacing.
  • Ethernet and USB  Three 10/100 Mbps Ethernet controllers and one USB 2.0 full/low‑rate port for networking and peripheral connectivity.
  • Additional Interfaces  I2C interface for board management and peripheral control.
  • Package & Mounting  516‑PBGA (27 × 27 mm) package, surface‑mount assembly.
  • Operating Range  Rated for 0 °C to 105 °C operation.
  • Qualification & Compliance  Consumer‑grade qualification and RoHS compliance.
  • Graphics  No graphics acceleration is provided.

Typical Applications

  • Embedded networking devices  Use the integrated Ethernet ports and communications co‑processors for routing, switching, or gateway functions in consumer network equipment.
  • Communication controllers  Offload protocol handling and multi‑channel communications tasks to the RISC CPM and onboard communications features.
  • Consumer connected systems  Integrate USB 2.0 and standard memory interfaces for consumer Ethernet‑enabled appliances and connected devices.

Unique Advantages

  • Integrated communications peripherals  Multiple 10/100 Ethernet controllers and a USB 2.0 port reduce the need for external controllers and simplify board design.
  • On‑chip memory support  DRAM/SDRAM controller functionality streamlines system memory integration and speeds time to market.
  • Dedicated co‑processing for communications  Communications and RISC CPM co‑processors offload protocol processing from the main CPU, improving application responsiveness.
  • Compact PBGA package  516‑PBGA (27×27) surface‑mount package provides a high‑density solution for space‑constrained embedded systems.
  • RoHS compliant  Environmentally compliant manufacturing reduces regulatory risk for consumer products.

Why Choose KMPC8270ZQMIBA?

The KMPC8270ZQMIBA positions itself as a compact, integration‑focused microprocessor for embedded and consumer networking applications. With a PowerPC G2_LE core, on‑chip communications co‑processors, multiple Ethernet ports and USB support, it offers a balanced mix of processing and connectivity for designs that require protocol handling and networked interfaces.

This device is suited to engineering teams building consumer‑grade embedded systems that benefit from reduced external component count, standard 3.3 V I/O, and a wide operating temperature range for typical consumer environments. RoHS compliance and a standard PBGA package support streamlined manufacturing and deployment.

Request a quote or submit an RFQ to receive pricing and availability information for KMPC8270ZQMIBA.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up