KMPC8265ACZUMIBC

IC MPU MPC82XX 200MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)

Quantity 1,575 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8265
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed200MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of KMPC8265ACZUMIBC – IC MPU MPC82XX 200MHz 480TBGA

The KMPC8265ACZUMIBC is a PowerPC G2-based microprocessor optimized for embedded communications and industrial applications. It is a single-core, 32-bit MPU running at 200 MHz with on-chip communications support and memory controller options aimed at networking and control systems.

With integrated communications co-processors, multiple 10/100 Mbps Ethernet interfaces, and industrial temperature qualification, this device targets designs that require deterministic embedded processing, robust connectivity, and compact TBGA packaging.

Key Features

  • Core PowerPC G2 architecture, single 32‑bit core operating at 200 MHz, providing deterministic embedded processing for communication tasks.
  • Caches & MMU Separate instruction and data caches (16 KB each) and a PowerPC‑compliant memory management unit (MMU) for efficient code and data handling.
  • Communications Processor Module (CPM) Integrated RISC CPM and communications co‑processor resources to offload serial and protocol handling from the main core.
  • Memory Controllers On‑chip DRAM and SDRAM controllers to support system memory interfaces.
  • Ethernet 10/100 Mbps Ethernet capability (specified as 10/100Mbps (3) in device data) for networked embedded systems.
  • Interfaces Standard embedded interfaces including I2C and serial peripheral support for system integration.
  • Power & Clock 3.3 V I/O supply specification with separate supply domains and PLL/clock configuration options described in the family specifications.
  • Package & Mounting 480‑TBGA package (37.5×37.5) with exposed pad; surface mount for high‑density PCB designs.
  • Operating Range & Qualification Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance for environmental compatibility.

Typical Applications

  • Embedded Networking Equipment Use the integrated Ethernet capabilities and CPM to build routers, switches, and network appliances with onboard packet handling.
  • Industrial Control Systems Industrial temperature rating and deterministic PowerPC G2 processing make it suitable for PLCs, controllers, and factory automation nodes.
  • Telecommunications Infrastructure On‑chip communications engines and serial interfaces support protocol handling and telecom control plane functions.
  • Embedded Gateways and Bridges Combine memory interface support and Ethernet to implement protocol gateways and fieldbus bridges.

Unique Advantages

  • Performance‑oriented PowerPC G2 core: Single 32‑bit core at 200 MHz provides predictable execution for embedded control and communications tasks.
  • Integrated communications engine: RISC CPM and communications co‑processor resources reduce external offload requirements and simplify BOM.
  • Ethernet connectivity: 10/100 Mbps Ethernet capability enables direct network integration for edge and infrastructure devices.
  • Industrial temperature qualification: −40 °C to 105 °C rating supports deployment in harsh and temperature‑sensitive environments.
  • Compact TBGA package: 480‑TBGA (37.5×37.5) packaging offers a high‑density surface‑mount footprint for space‑constrained PCBs.
  • Memory flexibility: On‑chip DRAM/SDRAM controllers allow straightforward system memory design and scaling.

Why Choose KMPC8265ACZUMIBC?

The KMPC8265ACZUMIBC brings together a PowerPC G2 processing core, integrated communications processing, and native memory and Ethernet support in a compact, industrially qualified TBGA package. This combination is well suited to designs that require embedded network connectivity, deterministic processing, and robust operation across wide temperature ranges.

Engineers and procurement teams designing communications equipment, industrial controllers, or embedded gateways will find this part delivers system integration benefits while adhering to RoHS environmental requirements. Its feature set supports long‑lifecycle deployments where stable performance and integration matter.

Request a quote or submit an inquiry to obtain pricing and availability for KMPC8265ACZUMIBC and to discuss your design and volume requirements.

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