KMPC8265AZUPJDC

IC MPU MPC82XX 300MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 300MHz 480-TBGA (37.5x37.5)

Quantity 1,897 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8265
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed300MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of KMPC8265AZUPJDC – IC MPU MPC82XX 300MHz 480TBGA

The KMPC8265AZUPJDC is a PowerPC G2-based microprocessor in the MPC8265 series, featuring a single 32-bit core running at 300 MHz. It targets embedded communications and general-purpose embedded applications where integrated networking interfaces and flexible memory support are required.

Built with an integrated Communications Processor Module (CPM) and multiport Ethernet capability, this device delivers a balance of processing performance, I/O integration, and package-level density for compact, surface-mount system designs.

Key Features

  • PowerPC G2 Core @ 300 MHz Single 32-bit core running at 300 MHz for integer processing and control-plane tasks.
  • Memory and Bus Support On-chip support for DRAM and SDRAM controllers and a 64-bit data / 32-bit address 60x bus architecture (series-level detail).
  • Integrated Communications Processor Module (CPM) CPM and RISC communications co-processor functionality for serial DMA, timing and protocol offload (series-level functionality).
  • Multiport Ethernet Three 10/100 Mbps Ethernet interfaces for network connectivity and packet handling.
  • Clock and Power Flexibility Separate PLLs for the G2 core and CPM and configurable clock multipliers to optimize power versus performance (series-level detail).
  • Peripheral Interfaces On-chip serial interfaces including I2C and multiple serial controllers for control and management functions (series-level detail).
  • Package and Mounting 480-ball TBGA package (37.5 × 37.5 mm) with exposed pad; surface-mount mounting for high-density board designs.
  • Operating Range and Compliance Rated for 0 °C to 105 °C operation and RoHS compliant.

Typical Applications

  • Networking & Communications Equipment — Suitable for routers, gateways, and switches that require integrated Ethernet ports and CPM-based serial processing.
  • Embedded Control Systems — Use in embedded controllers that need a 32-bit PowerPC core with DRAM/SDRAM support and multiple serial interfaces.
  • Telecommunications Modules — Ideal for telecom line cards and modules leveraging the CPM and multiport Ethernet for data plane tasks.
  • Compact Board-Level Systems — The 480-TBGA surface-mount package enables compact, high-density PCB implementations.

Unique Advantages

  • Integrated Communications Processing: CPM and communications co-processor capabilities reduce external component count for protocol handling and serial DMA.
  • Multiple Ethernet Ports On-Chip: Three 10/100 Mbps Ethernet interfaces provide built-in network connectivity without additional MAC/PHY controllers.
  • Flexible Memory Interfaces: DRAM and SDRAM controller support simplifies system memory design and enables straightforward expansion.
  • Configurable Clocking and Power Domains: Separate PLLs and clock multipliers for core and CPM allow tuning of performance versus power for application-specific needs.
  • RoHS Compliant, Broad Operating Range: RoHS compliance and 0 °C to 105 °C rated operation support a range of commercial embedded deployments.
  • High-Density Surface-Mount Package: 480-TBGA (37.5×37.5 mm) with exposed pad facilitates thermal performance and compact system layouts.

Why Choose KMPC8265AZUPJDC?

The KMPC8265AZUPJDC delivers a focused combination of a 300 MHz PowerPC G2 core with an integrated Communications Processor Module and multiport Ethernet, making it well suited for embedded communications and control applications that benefit from on-chip protocol handling and flexible memory support. Its configurable clock domains and surface-mount 480-TBGA package offer designers options to balance performance, thermal management, and board density.

This device is appropriate for engineers and procurement teams building networked embedded systems, telecom modules, and compact controller platforms that require integrated Ethernet connectivity, CPM functionality, and RoHS-compliant sourcing with a defined commercial temperature rating.

Request a quote or submit an inquiry to check current pricing, availability, and lead times for KMPC8265AZUPJDC.

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