KMPC8250AVVPIBC

The KMPC8250AVVPIBC is a PowerPC G2-based PowerQUICC II communications microprocessor offered by NXP Semiconductors. It integrates a single 32-bit PowerPC G2 core running at 300 MHz with on-chip communications and peripheral subsystems, targeting embedded networking and communications applications where integration and deterministic I/O matter.

This device combines processor performance, dedicated communications co-processing, and multiple I/O controllers to simplify designs that require integrated Ethernet, serial interfaces, and DRAM/SDRAM memory control within a 480-pin TBGA package.

Key Features

• Core & Performance Single PowerPC G2 32-bit core operating at 300 MHz, with architecture-level features drawn from the G2 core family for embedded processing.
• On‑chip Communications Co‑processor (CPM) Includes a communications RISC CPM to offload protocol processing and serial DMA tasks for real-time communications workloads.
• Memory Subsystem Integrated DRAM and SDRAM controllers to support system memory needs and streamline board-level memory design.
• Ethernet Connectivity Three 10/100 Mbps Ethernet ports provide multi-port LAN connectivity directly on the processor for networking and communications equipment.
• Peripheral Interfaces Multiple serial interfaces including I2C and other serial controllers exposed via the CPM for sensor, control, and management connections.
• Cache, MMU and FPU On-chip instruction and data caches, a PowerPC-compliant MMU, and a floating-point unit to support performance and system software requirements (features per MPC8250 series documentation).
• Power Management Separate power domains with an internal logic supply (1.8 V) and I/O supply (3.3 V) plus independent PLLs for core and CPM clocking, enabling flexible frequency and power optimization.
• Package & Mounting 480-TBGA (37.5 × 37.5 mm) with exposed pad, surface-mount package suitable for compact system designs requiring a high pin-count processor.
• Operating Range & Compliance Qualified to operate from 0 °C to 105 °C and RoHS compliant for regulatory and environmental alignment.

Typical Applications

• Embedded Networking Equipment Multi‑port 10/100 Mbps Ethernet and on‑chip CPM make this device suitable for routers, switches, and gateway controllers that need integrated packet handling.
• Communications Infrastructure Designed for communications-centric embedded systems where protocol offload and deterministic serial I/O reduce system complexity.
• Industrial Control and Automation On‑chip memory controllers and robust I/O support PLCs, protocol converters, and control nodes that require sustained operation at elevated temperatures.
• Appliance and Consumer Networking Consumer-grade qualification combined with integrated networking and peripheral interfaces supports home gateways, media bridges, and similar devices.

Unique Advantages

• Integrated Communications Subsystem: CPM and serial DMA engines reduce host CPU load and simplify implementation of complex protocol stacks.
• Multi‑port Ethernet on Chip: Three 10/100 Mbps interfaces enable compact multi‑port designs without discrete Ethernet controllers, lowering BOM and board area.
• Flexible Clocking and Power Domains: Separate PLLs and power supplies for core and I/O allow frequency partitioning and optimized power/performance trade-offs.
• High Pin-Count TBGA Package: 480‑TBGA footprint provides extensive I/O and memory connectivity in a single surface-mount component for dense embedded systems.
• Robust Memory Support: On-chip DRAM/SDRAM controllers streamline memory integration and improve system-level performance predictability.
• RoHS Compliance: Meets RoHS environmental requirements for modern electronics manufacturing.

Why Choose KMPC8250AVVPIBC?

The KMPC8250AVVPIBC positions itself as a highly integrated communications-focused microprocessor that pairs a 300 MHz PowerPC G2 core with an on-chip communications processor, multi-port Ethernet, and comprehensive memory controllers. This combination reduces system complexity and BOM for embedded networking and control designs that require deterministic I/O and protocol handling.

Designed for engineers building consumer and industrial communications products, the KMPC8250AVVPIBC offers scalability through its integrated subsystems, robust thermal range up to 105 °C, and the form factor needed for compact, high-density boards. Manufacturer support and the MPC8250 family documentation provide the technical resources required for system bring‑up and long‑term deployment.

Request a quote or submit your procurement inquiry today to evaluate KMPC8250AVVPIBC for your next embedded communications design.