KMPC8250ACVVMHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 1,421 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of KMPC8250ACVVMHBC – IC MPU MPC82XX 266MHZ 480TBGA
The KMPC8250ACVVMHBC is a single‑core PowerPC G2 microprocessor in a 480‑TBGA package optimized for embedded and communications applications. It integrates a high‑performance 32‑bit PowerPC G2 core running at 266 MHz with on‑chip communications and system peripherals to address industrial embedded networking and control designs.
Designed for industrial environments, this device combines processor performance, on‑chip communications acceleration and flexible clocking to simplify system integration for applications requiring multiple Ethernet interfaces, DRAM/SDRAM support and robust thermal range.
Key Features
- Core PowerPC G2 single 32‑bit core operating at 266 MHz, including on‑chip instruction and data caches and an MMU as described in the device hardware specifications.
- Communications Processor Module (CPM) Includes a RISC CPM/co‑processor for communications tasks, enabling offload of protocol handling and serial DMA operations.
- Ethernet Three 10/100 Mbps Ethernet interfaces for multi‑port network connectivity and embedded networking applications.
- Memory Subsystem On‑chip controllers for DRAM and SDRAM, plus separate instruction and data caches to support efficient memory access.
- Clocking and PLLs Separate PLLs for the G2 core and the CPM allow independent core and communications clocking for power/performance optimization.
- Power Separate internal logic power (1.8 V) and I/O power (3.3 V) domains; I/O operates at 3.3 V.
- Package and Mounting 480‑TBGA (37.5×37.5 mm) package with exposed pad, surface‑mount mounting and a 480‑LBGA exposed pad package case option.
- Operating Range and Qualification Industrial qualification with an operating temperature range of −40 °C to 105 °C.
- Additional Interfaces Includes I2C and multiple serial interfaces and peripheral controllers described in the device hardware specifications.
Typical Applications
- Industrial Communications Equipment Multi‑port network controllers and protocol gateways leveraging the integrated CPM and three 10/100 Mbps Ethernet ports.
- Embedded Networking Appliances Routers, switches and edge devices that require on‑chip Ethernet, DMA and memory controller integration.
- Industrial Control Systems Controller and supervisory platforms that benefit from the industrial temperature range and on‑chip peripherals for deterministic I/O and communication handling.
Unique Advantages
- Integrated Communications Acceleration: On‑chip RISC CPM reduces CPU load for protocol processing and serial DMA tasks, simplifying software partitioning.
- Multiple Ethernet Ports: Three 10/100 Mbps interfaces provide native multi‑port networking capability without external PHY aggregation.
- Flexible Clocking: Separate PLLs for the core and CPM enable tailored performance and power trade‑offs for processing and communications workloads.
- Industrial‑Grade Operation: Qualified for −40 °C to 105 °C operation to meet demanding environmental requirements.
- Compact, Thermally Managed Package: 480‑TBGA with exposed pad provides a compact footprint and thermal interface for board‑level thermal management.
- Memory and I/O Integration: On‑chip DRAM/SDRAM controllers, caches and serial interfaces reduce external components and simplify board design.
Why Choose KMPC8250ACVVMHBC?
The KMPC8250ACVVMHBC positions itself as a workhorse for embedded communications and industrial systems that require a single PowerPC G2 core at 266 MHz combined with dedicated communications acceleration and multi‑port Ethernet connectivity. Its integrated memory controllers, flexible clocking, and industrial temperature qualification make it suitable for compact, reliable embedded networked designs.
Backed by detailed hardware specifications and documentation, this device is appropriate for engineers seeking a highly integrated microprocessor solution with on‑chip communications features and robust operating range for industrial deployments.
Request a quote or submit a purchase inquiry to obtain pricing and availability for the KMPC8250ACVVMHBC.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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