KMPC8250ACZUMHBC

IC MPU MPC82XX 266MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5)

Quantity 759 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8250
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed266MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of KMPC8250ACZUMHBC – IC MPU MPC82XX 266MHZ 480TBGA

The KMPC8250ACZUMHBC is a PowerPC G2-based microprocessor in the MPC82xx family, delivering a single 32-bit core at 266 MHz. It integrates communications-focused co-processors and memory controllers to address embedded system requirements.

Designed for embedded and industrial applications, this device combines on-chip communications acceleration, multiple Ethernet ports, and robust thermal/voltage characteristics to support reliable operation across a wide temperature range.

Key Features

  • Core and Performance  PowerPC G2 single-core, 32-bit processor running at 266 MHz with separate instruction and data caches (16 KB each) and an integrated floating-point unit as described in the MPC8250 family documentation.
  • Communications Offload  Includes communications co-processors and a RISC CPM to handle serial and network tasks; the device provides three 10/100 Mbps Ethernet interfaces for networking connectivity.
  • Memory and Bus  On-chip DRAM/SDRAM controllers and a high-performance system bus (60x/Local Bus and PCI interface described for the MPC8250 series) enable flexible memory subsystem designs.
  • Clocking and Power  Separate PLLs and clock multipliers for the core and CPM allow independent frequency scaling; the device uses separate supplies for internal logic and I/O (core ~1.8 V, I/O 3.3 V).
  • Interfaces  Multiple serial interfaces including I2C are supported alongside several serial communication controllers, SPI and MII ports as documented for the MPC8250 family.
  • Package and Mounting  480-TBGA package (37.5×37.5 mm) with exposed pad, 480-ball LBGA footprint; surface-mount mounting type for compact board implementation.
  • Industrial Qualification and Temperature  Industrial-qualified device rated for an operating temperature range of −40 °C to 105 °C for use in demanding environments.
  • Standards and Compliance  RoHS‑compliant supply status for regulatory and environmental conformity.

Typical Applications

  • Embedded Communications Equipment  Leverages the on-chip CPM and multiple Ethernet ports for routers, switches, and protocol-handling modules where packet processing and serial connectivity are required.
  • Industrial Control Systems  Industrial temperature rating and robust I/O make it suitable for controllers and automation devices that require reliable operation across wide thermal ranges.
  • Networking Appliances  Combines core processing and dedicated communications hardware to support network interface cards, gateway devices, and other networking appliances.
  • Telecommunications Infrastructure  Supports telecom functions through TDM and serial interfaces as described for the MPC8250 series, enabling use in infrastructure equipment.

Unique Advantages

  • Integrated Communications Processing: The included communications co-processors and RISC CPM reduce host CPU load for serial and network tasks, simplifying system partitioning.
  • Independent Clock Domains: Separate PLLs and clock multipliers for core and CPM allow performance/power tuning across processing and communications functions.
  • Compact Thermal-Friendly Package: 480-TBGA with exposed pad supports PCB thermal management while maintaining a high pin count for extensive I/O.
  • Industrial-Grade Reliability: Rated for −40 °C to 105 °C and industrial qualification, enabling deployment in temperature-critical embedded systems.
  • Memory and Interface Flexibility: On-chip DRAM/SDRAM controllers, multiple serial interfaces, PCI/local bus support and Ethernet ports provide a versatile platform for diverse embedded designs.

Why Choose KMPC8250ACZUMHBC?

The KMPC8250ACZUMHBC positions itself as a highly integrated embedded processor for applications that require combined general-purpose compute and dedicated communications handling. With a PowerPC G2 core, on-chip CPM, multiple Ethernet interfaces, and flexible clocking, it delivers a balanced mix of processing and networking capability tailored to industrial and embedded systems.

This part is suitable for designers seeking an industrial-qualified, RoHS-compliant MPU in a compact TBGA package with comprehensive memory and serial interface support. Its architecture and features support scalable designs where offloading communications tasks and maintaining operation across wide temperature ranges are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the KMPC8250ACZUMHBC. Our team can provide lead-time details and support for integrating this device into your next embedded design.

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