KMPC8250ACZUMHBC
| Part Description |
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 480-TBGA (37.5x37.5) |
|---|---|
| Quantity | 759 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8250 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC G2 | Device Package | 480-TBGA (37.5x37.5) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A001A3 | Ethernet | 10/100Mbps (3) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 105°C (TA) | ||
| Package / Case | 480-LBGA Exposed Pad | RAM Controllers | DRAM, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 266MHz | Supplier Device Package | 480-TBGA (37.5×37.5) | ||
| Voltage – I/O | 3.3V |
Overview of KMPC8250ACZUMHBC – IC MPU MPC82XX 266MHZ 480TBGA
The KMPC8250ACZUMHBC is a PowerPC G2-based microprocessor in the MPC82xx family, delivering a single 32-bit core at 266 MHz. It integrates communications-focused co-processors and memory controllers to address embedded system requirements.
Designed for embedded and industrial applications, this device combines on-chip communications acceleration, multiple Ethernet ports, and robust thermal/voltage characteristics to support reliable operation across a wide temperature range.
Key Features
- Core and Performance PowerPC G2 single-core, 32-bit processor running at 266 MHz with separate instruction and data caches (16 KB each) and an integrated floating-point unit as described in the MPC8250 family documentation.
- Communications Offload Includes communications co-processors and a RISC CPM to handle serial and network tasks; the device provides three 10/100 Mbps Ethernet interfaces for networking connectivity.
- Memory and Bus On-chip DRAM/SDRAM controllers and a high-performance system bus (60x/Local Bus and PCI interface described for the MPC8250 series) enable flexible memory subsystem designs.
- Clocking and Power Separate PLLs and clock multipliers for the core and CPM allow independent frequency scaling; the device uses separate supplies for internal logic and I/O (core ~1.8 V, I/O 3.3 V).
- Interfaces Multiple serial interfaces including I2C are supported alongside several serial communication controllers, SPI and MII ports as documented for the MPC8250 family.
- Package and Mounting 480-TBGA package (37.5×37.5 mm) with exposed pad, 480-ball LBGA footprint; surface-mount mounting type for compact board implementation.
- Industrial Qualification and Temperature Industrial-qualified device rated for an operating temperature range of −40 °C to 105 °C for use in demanding environments.
- Standards and Compliance RoHS‑compliant supply status for regulatory and environmental conformity.
Typical Applications
- Embedded Communications Equipment Leverages the on-chip CPM and multiple Ethernet ports for routers, switches, and protocol-handling modules where packet processing and serial connectivity are required.
- Industrial Control Systems Industrial temperature rating and robust I/O make it suitable for controllers and automation devices that require reliable operation across wide thermal ranges.
- Networking Appliances Combines core processing and dedicated communications hardware to support network interface cards, gateway devices, and other networking appliances.
- Telecommunications Infrastructure Supports telecom functions through TDM and serial interfaces as described for the MPC8250 series, enabling use in infrastructure equipment.
Unique Advantages
- Integrated Communications Processing: The included communications co-processors and RISC CPM reduce host CPU load for serial and network tasks, simplifying system partitioning.
- Independent Clock Domains: Separate PLLs and clock multipliers for core and CPM allow performance/power tuning across processing and communications functions.
- Compact Thermal-Friendly Package: 480-TBGA with exposed pad supports PCB thermal management while maintaining a high pin count for extensive I/O.
- Industrial-Grade Reliability: Rated for −40 °C to 105 °C and industrial qualification, enabling deployment in temperature-critical embedded systems.
- Memory and Interface Flexibility: On-chip DRAM/SDRAM controllers, multiple serial interfaces, PCI/local bus support and Ethernet ports provide a versatile platform for diverse embedded designs.
Why Choose KMPC8250ACZUMHBC?
The KMPC8250ACZUMHBC positions itself as a highly integrated embedded processor for applications that require combined general-purpose compute and dedicated communications handling. With a PowerPC G2 core, on-chip CPM, multiple Ethernet interfaces, and flexible clocking, it delivers a balanced mix of processing and networking capability tailored to industrial and embedded systems.
This part is suitable for designers seeking an industrial-qualified, RoHS-compliant MPU in a compact TBGA package with comprehensive memory and serial interface support. Its architecture and features support scalable designs where offloading communications tasks and maintaining operation across wide temperature ranges are priorities.
Request a quote or submit an inquiry to receive pricing and availability information for the KMPC8250ACZUMHBC. Our team can provide lead-time details and support for integrating this device into your next embedded design.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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