KMPC8260ACZUMIBB

IC MPU MPC82XX 200MHZ 480TBGA
Part Description

PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 480-TBGA (37.5x37.5)

Quantity 1,173 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8260
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPC G2Device Package480-TBGA (37.5x37.5)
ECCN3A001A3Ethernet10/100Mbps (3)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case480-LBGA Exposed PadRAM ControllersDRAM, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed200MHzSupplier Device Package480-TBGA (37.5×37.5)
Voltage – I/O3.3V

Overview of KMPC8260ACZUMIBB – IC MPU MPC82XX 200MHZ 480TBGA

The KMPC8260ACZUMIBB is a PowerPC G2 single-core 32-bit microprocessor in the MPC8260 family, rated at 200 MHz and supplied in a 480-TBGA (37.5 × 37.5 mm) surface-mount package. Designed for embedded communications and industrial applications, it integrates a communications processor module (RISC CPM), multiple Ethernet interfaces, and memory controllers to support robust networking and control use cases.

This industrial-qualified device is specified for operation from −40 °C to 105 °C, supports 3.3 V I/O, and is RoHS compliant, providing a compact, high-functionality building block for industrial networking, telecom, and embedded communications systems.

Key Features

  • Core & Performance  PowerPC G2 single core, 32-bit architecture running at 200 MHz for deterministic embedded processing.
  • Cache & FPU  Family-level hardware includes separate 16 Kbyte instruction and 16 Kbyte data caches, and a floating-point unit (FPU) to accelerate numeric and control workloads.
  • Communications Processor Module (CPM)  Integrated RISC CPM co-processor for communications tasks, enabling offload of serial and network protocol handling.
  • Ethernet Connectivity  Three 10/100 Mbps Ethernet ports provide multiple physical network interfaces for embedded networking and gateway designs.
  • Memory Controllers  On-chip DRAM and SDRAM controllers simplify external memory interfacing for system memory and buffering.
  • Clocking & Power  Separate PLLs for the G2 core and the CPM with internal clock multipliers support different core and CPM frequencies for power/performance optimization.
  • Package & Mounting  480-lead TBGA exposed pad package (37.5 × 37.5 mm) optimized for surface-mount assembly and thermal dissipation.
  • Industrial Temperature Range  Specified for −40 °C to 105 °C operation and designated as Industrial qualification for deployment in demanding environments.
  • Standard Interfaces  Includes I²C interface and additional serial/peripheral interfaces via the CPM for common embedded connectivity tasks.
  • Regulatory/Environmental  RoHS compliant to meet modern environmental and manufacturing requirements.

Typical Applications

  • Embedded Networking & Gateways  Multiple 10/100 Mbps Ethernet ports and the CPM make this device suitable for protocol bridging, embedded routers, and gateway applications.
  • Industrial Control Systems  Industrial temperature qualification and robust memory interfaces support use in process control, PLCs, and remote I/O controllers.
  • Telecommunications Equipment  Integrated communications acceleration (RISC CPM) and multiple network interfaces allow implementation of line cards, media gateways, and comms modules.
  • High-Reliability Embedded Platforms  Deterministic single-core PowerPC processing with on-chip memory support serves real-time control and critical embedded tasks.

Unique Advantages

  • Integrated Communications Offload: The RISC CPM co-processor reduces CPU load for serial and network protocol processing, simplifying software architecture and improving throughput.
  • Multiple Ethernet Interfaces: Three 10/100 Mbps ports enable versatile network topologies without external MACs, reducing BOM and board complexity.
  • Industrial Temperature Qualification: −40 °C to 105 °C rating supports deployment in harsh and temperature-variable environments common to industrial applications.
  • Flexible Clocking for Power/Performance: Separate PLLs and internal clock multipliers for core and CPM let designers balance performance and power consumption.
  • Compact, Thermally Managed Package: 480-TBGA with exposed pad supports high pin count integration while enabling thermal dissipation for sustained operation.
  • RoHS Compliant: Meets environmental manufacturing requirements for modern production flows.

Why Choose KMPC8260ACZUMIBB?

The KMPC8260ACZUMIBB positions itself as a high-integration microprocessor choice for embedded communications and industrial systems that require deterministic PowerPC G2 processing, on-chip communications acceleration, and multiple Ethernet interfaces. Its combination of memory controllers, CPM offload, and industrial temperature rating makes it suitable for designers building rugged networking, telecom, and control platforms.

Backed by NXP Semiconductor family-level documentation and designed for RoHS-compliant manufacturing, this part delivers a balance of integration, performance, and thermal/package considerations that support scalable, long-lived embedded deployments.

Request a quote or submit a procurement inquiry to begin sourcing KMPC8260ACZUMIBB for your next embedded communications or industrial networking design.

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