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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | MC7447AHX733NB | NXP Semiconductors | IC MPU MPC74XX 733MHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 733MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,038 | ||
 | MC7447AHX867NB | NXP Semiconductors | IC MPU MPC74XX 867MHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 867MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 799 | ||
 | MC7447ATHX1000NB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 349 | ||
 | MC7447ATHX1167NB | NXP Semiconductors | IC MPU MPC74XX 1.167GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.167GHZ Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 179 | ||
 | MC7447AVS1000NB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCLGA | Microprocessors | 360-FCCLGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25×25) | 1,181 | ||
 | MC7447AVS1267LB | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360LGA | Microprocessors | 360-FCCLGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25×25) | 332 | ||
 | MC7447AVU1000LB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 538 | ||
 | MC7447AVU1000NB | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 130 | ||
 | MC7447AVU1167NB | NXP Semiconductors | IC MPU MPC74XX 1.167GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.167GHZ Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 156 | ||
 | MC7447AVU1420LB | NXP Semiconductors | IC MPU MPC74XX 1.42GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.42GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,277 | ||
 | MC7447AVU600NB | NXP Semiconductors | IC MPU MPC74XX 600MHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 237 | ||
 | MC7447AVU733NB | NXP Semiconductors | IC MPU MPC74XX 733MHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 733MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 621 | ||
 | MC7447AVU867NB | NXP Semiconductors | IC MPU MPC74XX 867MHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 867MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 984 | ||
 | MC7448HX1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 931 | ||
 | MC7448HX1000ND | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Mounting Type: Surface Mount | 609 | ||
 | MC7448HX1250ND | NXP Semiconductors | IC MPU MPC74XX 1.25GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.25GHz Mounting Type: Surface Mount | 1,800 | ||
 | MC7448HX1267NC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 168 | ||
 | MC7448HX1267ND | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Mounting Type: Surface Mount | 415 | ||
 | MC7448HX1400NC | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 1,294 | ||
 | MC7448HX1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.4GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 857 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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