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Microprocessors
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | MC7457RX1000LC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,234 | ||
| N/A | MC7457RX1000NC | NXP Semiconductors | IC MPU MPC7457 1GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,511 | ||
![]() | MC7457RX1267LC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 483BGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 722 | ||
![]() | MC7457RX867NC | NXP Semiconductors | IC MPU MPC74XX 867MHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 867MHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,375 | ||
![]() | MC7457TRX1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 907 | ||
![]() | MC7457VG1000LC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,481 | ||
![]() | MC7457VG1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 569 | ||
![]() | MC7457VG1267LC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 483BGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.267GHz Co-Processors/DSP: Multimedia; SIMD Graphics Acceleration: No Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 961 | ||
![]() | MC860ENCVR50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 53 | ||
![]() | MC860ENCZQ50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 352 | ||
![]() | MC860SRCVR50D4R2 | NXP Semiconductors | IC MPU MPC8XX 50MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 95°C (TA) | Core Processor: MPC8xx Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 50MHz Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Ethernet: 10Mbps (4) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 95°C (TA) Mounting Type: Surface Mount Package / Case: 357-BBGA Supplier Device Package: 357-PBGA (25×25) Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART | 767 | ||
![]() | MC8610PX1066JB | NXP Semiconductors | IC MPU MPC86XX 1.066GHZ 783BGA | Microprocessors | 783-FCPBGA (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.066GHz Mounting Type: Surface Mount | 591 | ||
![]() | MC8610TPX1066JB | NXP Semiconductors | IC MPU MPC86XX 1.066GHZ 783BGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.066GHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI | 1,394 | ||
![]() | MC8610TPX800GB | NXP Semiconductors | IC MPU MPC86XX 800MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: DIU, LCD Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 783-BBGA, FCBGA Supplier Device Package: 783-FCPBGA (29×29) Additional Interfaces: AC97, DUART, HSSI, I2C, I2S, IrDA, PCI, SPI | 417 | ||
![]() | MC8610VT800GB | NXP Semiconductors | IC MPU MPC86XX 800MHZ 783FCPBGA | Microprocessors | 783-FCPBGA (29x29) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e600 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Mounting Type: Surface Mount | 1,099 | ||
![]() | N/A | MC8640DHJ1067NE | NXP Semiconductors | IC MPU MPC86XX 1.067GHZ 1023BGA | Microprocessors | 1023-FCCBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (4) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 1023-BCBGA, FCBGA Supplier Device Package: 1023-FCCBGA (33×33) Additional Interfaces: DUART, HSSI, I2C, RapidIO | 552 | |
![]() | N/A | MC8640DHX1000HE | NXP Semiconductors | IC MPU MPC86XX 1.0GHZ 1023FCCBGA | Microprocessors | 1023-FCCBGA (33x33) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Mounting Type: Surface Mount | 177 | |
![]() | N/A | MC8640DHX1067NE | NXP Semiconductors | IC MPU MPC86XX 1.067GHZ 1023BGA | Microprocessors | 1023-FCCBGA (33x33) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz Mounting Type: Surface Mount | 217 | |
![]() | N/A | MC8640DHX1250HE | NXP Semiconductors | IC MPU MPC86XX 1.25GHZ 1023BGA | Microprocessors | 1023-FCCBGA (33x33) | 1.8V, 2.5V, 3.3V | 0°C – 105°C | Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.25GHz Mounting Type: Surface Mount | 293 | |
![]() | MC8640DTHJ1067NE | NXP Semiconductors | IC MPU MPC86XX 1.067GHZ 1023BGA | Microprocessors | 1023-FCCBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e600 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.067GHz RAM Controllers: DDR, DDR2 Graphics Acceleration: No Ethernet: 10/100/1000Mbps (4) Voltage – I/O: 1.8V, 2.5V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 1023-BCBGA, FCBGA Supplier Device Package: 1023-FCCBGA (33×33) Additional Interfaces: DUART, HSSI, I2C, RapidIO | 1,076 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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