Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC8640THJ1250HEN/AMC8640THJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
160
MC8640THX1067NEN/AMC8640THX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,262
MC8640THX1250HEN/AMC8640THX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
388
MC8640TVJ1067NEN/AMC8640TVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
506
MC8640TVJ1250HEN/AMC8640TVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
70
MC8640TVU1067NEN/AMC8640TVU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
1,361
MC8640TVU1250HEN/AMC8640TVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
261
MC8640VJ1000HEN/AMC8640VJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
823
MC8640VJ1067NEN/AMC8640VJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
246
MC8640VU1000HEN/AMC8640VU1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,828
MC8640VU1067NEN/AMC8640VU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
880
MC8641DHX1000NEMC8641DHX1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,721
N/AMC8641DHX1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,386
MC8641DTHX1333JEMC8641DTHX1333JENXP SemiconductorsRISC MICROPROCESSOR, 32-BIT, POWMicroprocessors1023-FCCBGA (33x33)N/A-40 °C – 105 °C
Voltage – I/O:
1.8 V – 3.3 V
Core Processor:
PowerPC e600
RAM Controllers:
DDR, DDR2
Ethernet:
10/100/1000Mbps (4)
Graphics Acceleration:
No
Qualification:
Industrial
607
MC8641DTVJ1333JEMC8641DTVJ1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
801
MC8641DTVU1333JCMC8641DTVU1333JCNXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
1,887
MC8641DTVU1333JEMC8641DTVU1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
Mounting Type:
Surface Mount
56
MC8641DVJ1000NEMC8641DVJ1000NENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
321
MC8641DVJ1333JEMC8641DVJ1333JENXP SemiconductorsIC MPU MPC86XX 1.333GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.333GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,264
MC8641DVJ1500KEMC8641DVJ1500KENXP SemiconductorsIC MPU MPC86XX 1.5GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
581

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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