Microprocessors

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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC8640DTHJ1250HEN/AMC8640DTHJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
678
MC8640DTHX1000HEN/AMC8640DTHX1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
275
MC8640DTHX1067NCMC8640DTHX1067NCNXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
84
MC8640DTHX1067NEN/AMC8640DTHX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
570
MC8640DTHX1250HEN/AMC8640DTHX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
364
MC8640DTVJ1000HEN/AMC8640DTVJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,116
MC8640DTVJ1067NEMC8640DTVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,685
MC8640DTVJ1250HEN/AMC8640DTVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,110
MC8640DTVU1000HEN/AMC8640DTVU1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
414
MC8640DTVU1067NEN/AMC8640DTVU1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
905
MC8640DTVU1250HEN/AMC8640DTVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
1,303
MC8640DVJ1000HEN/AMC8640DVJ1000HENXP SemiconductorsIC MPU MPC86XX 1.0GHZ 1023FCCBGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.0GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
267
MC8640DVJ1067NEN/AMC8640DVJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
1,603
MC8640DVJ1250HEN/AMC8640DVJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BCBGA, FCCBGA
Supplier Device Package:
1023-FCCBGA (33×33)
292
MC8640DVU1250HEN/AMC8640DVU1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 1023BGAMicroprocessors1023-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
684
MC8640HJ1067NEN/AMC8640HJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
437
MC8640HJ1250HEN/AMC8640HJ1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,251
MC8640HX1067NEN/AMC8640HX1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Mounting Type:
Surface Mount
737
MC8640HX1250HEN/AMC8640HX1250HENXP SemiconductorsIC MPU MPC86XX 1.25GHZ 994FCCBGAMicroprocessors994-FCCBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.25GHz
Mounting Type:
Surface Mount
36
MC8640THJ1067NEN/AMC8640THJ1067NENXP SemiconductorsIC MPU MPC86XX 1.067GHZ 994BGAMicroprocessors994-FCCBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e600
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (4)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
994-BCBGA, FCCBGA
Supplier Device Package:
994-FCCBGA (33×33)
1,796

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About Microprocessors

Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.

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