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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MPC8560CPX667JBMPC8560CPX667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
1,303
MPC8560CVT667JBMPC8560CVT667JBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
206
MPC8560CVT667JCMPC8560CVT667JCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCBGAMicroprocessors783-FCBGA (29x29)2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Mounting Type:
Surface Mount
596
MPC8560PX667LCMPC8560PX667LCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
59
MPC8560PX833LBMPC8560PX833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
491
MPC8560VT667LBMPC8560VT667LBNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
404
MPC8560VT667LCMPC8560VT667LCNXP SemiconductorsIC MPU MPC85XX 667MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
667MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
679
MPC8560VT833LBMPC8560VT833LBNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
724
MPC8560VT833LCMPC8560VT833LCNXP SemiconductorsIC MPU MPC85XX 833MHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
833MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
243
MPC8560VTAQFBMPC8560VTAQFBNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BFBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
I2C, PCI, RapidIO, SPI, TDM, UART
876
MPC8560VTAQFCMPC8560VTAQFCNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 783FCPBGAMicroprocessors783-FCPBGA (29x29)2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
940
MPC8568ECVTAQGGMPC8568ECVTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)1.8V, 2.5V, 3.3V-40°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
714
MPC8568EVTAQGGMPC8568EVTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
168
MPC8568EVTAUJJMPC8568EVTAUJJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine, Security; SEC
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
524
MPC8568VTAQGGMPC8568VTAQGGNXP SemiconductorsIC MPU MPC85XX 1.0GHZ 1023FCPBGAMicroprocessors1023-FCPBGA (33x33)1.8V, 2.5V, 3.3V0°C – 105°C
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Mounting Type:
Surface Mount
1,517
MPC8568VTAUJJMPC8568VTAUJJNXP SemiconductorsIC MPU MPC85XX 1.333GHZ 1023BGAMicroprocessors1023-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.333GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
1023-BBGA, FCBGA
Supplier Device Package:
1023-FCPBGA (33×33)
Additional Interfaces:
DUART, HSSI, I2C, PCI, RapidIO, UART
160
N/AMPC8569CVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A

N/A

229
MPC8569CVJAQLJBMPC8569CVJAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
541
MPC8569CVTAQLJBMPC8569CVTAQLJBNXP SemiconductorsIC MPU MPC85XX 1.067GHZ 783BGAMicroprocessors783-FCPBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e500v2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.067GHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR2, DDR3, SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (8), 1Gbps (4)
USB:
USB 2.0 (1)
Voltage – I/O:
1.0V, 1.5V, 1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
783-BBGA, FCBGA
Supplier Device Package:
783-FCPBGA (29×29)
Additional Interfaces:
DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
1,938
N/AMPC8569ECVJANKGBNXP SemiconductorsPOWERQUICC 32 BIT POWER ARCHITECMicroprocessorsN/AN/AN/A

N/A

85

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