MPC8569CVJAQLJB

IC MPU MPC85XX 1.067GHZ 783BGA
Part Description

PowerPC e500v2 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.067GHz 783-FCPBGA (29x29)

Quantity 514 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8569
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; QUICC EngineCore ProcessorPowerPC e500v2Device Package783-FCPBGA (29x29)
ECCN5A002A1Ethernet10/100Mbps (8), 1Gbps (4)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR2, DDR3, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.067GHzSupplier Device Package783-FCPBGA (29×29)
USBUSB 2.0 (1)Voltage – I/O1.0V, 1.5V, 1.8V, 2.5V, 3.3V

Overview of MPC8569CVJAQLJB – IC MPU MPC85XX 1.067GHZ 783BGA

The MPC8569CVJAQLJB is a PowerPC e500v2 32-bit microprocessor running at 1.067 GHz, offered by NXP Semiconductors. It delivers a single-core embedded processing solution with integrated communications and security engines targeted at industrial and networking applications.

Designed for systems that require high integration of connectivity, memory and security functions, the device combines multi-interface networking, hardware crypto acceleration and robust memory controllers with an industrial operating temperature range for deployment in demanding embedded environments.

Key Features

  • Core — PowerPC e500v2 32-bit core at 1.067 GHz with memory management unit (MMU), double-precision embedded floating-point APU and embedded vector/scalar single-precision floating-point APUs.
  • On-chip caches — Integrated L1 caches (32 KB instruction, 32 KB data) and a 512 KB L2 cache for reduced memory latency and improved system performance.
  • Memory subsystem — Two DDR2/DDR3 SDRAM controllers with full ECC support, up to 16 Gbytes of main memory, support for up to 400 MHz clock (800 MHz data rate) and features for battery-backed memory and initialization bypass.
  • Integrated security — Security engine (SEC) optimized for IPsec, IKE, SSL/TLS and related algorithms, with multiple cryptographic execution units and a hardware random number generator.
  • QUICC Engine communications — On-chip QUICC Engine with four 32-bit RISC cores supporting Ethernet, ATM, POS and T1/E1, plus multi-protocol offload and IEEE 1588 v2 support.
  • High-density networking — Up to four 1 Gbps Ethernet interfaces (up to two via SGMII) and up to eight 10/100 Mbps Ethernet interfaces; support for T1/E1 TDM links and Ethernet PHY management.
  • High-speed I/O — Support for up to two Serial RapidIO interfaces or one 4x interface, ×4/×2/×1 PCI Express, two SGMII interfaces, one USB 2.0 full-/low-speed port, DUART and general-purpose I/O.
  • System fabric and DMA — On-chip network switch fabric, four-channel DMA controller, programmable interrupt controller and IEEE 1149.1 JTAG test access.
  • Power and I/O voltages — Core voltages at 1.0 V and 1.1 V with available I/O voltages of 3.3 V, 2.5 V, 1.8 V, 1.5 V and 1.0 V.
  • Package and qualification — 783-pin FC-PBGA (783-FCPBGA, 29 × 29 mm) surface-mount package; industrial qualification with operating temperature range of -40 °C to 105 °C.

Typical Applications

  • Network infrastructure — Routers, security gateways and switches that require multiple Gigabit and 10/100 Ethernet interfaces and hardware acceleration for packet processing.
  • Telecommunications equipment — T1/E1 and TDM-based systems leveraging the QUICC Engine and multi-channel TDM support for carrier-grade protocols.
  • Secure appliances — Firewalls, VPN concentrators and TLS/SSL accelerators that benefit from the integrated security engine and hardware cryptographic units.
  • Storage and RAID controllers — Storage controllers using the SEC XOR engine for parity and ECC-protected DDR memory for data integrity.
  • Industrial embedded systems — Controllers and communication nodes requiring industrial temperature range, multiple I/O voltage options and robust memory management.

Unique Advantages

  • Highly integrated platform: Combines processing core, QUICC communications engine, security engine and multiple high-speed interfaces on a single device to reduce BOM and board complexity.
  • Extensive networking I/O: Multiple Gigabit and 10/100 Ethernet ports plus PCIe, Serial RapidIO and SGMII options for flexible system architectures.
  • Hardware security acceleration: Dedicated crypto units and RNG accelerate IPsec, SSL/TLS and other secure-protocol workloads while offloading the main core.
  • Memory reliability and scalability: Dual DDR2/DDR3 controllers with full ECC support and up to 16 GB addressable memory capacity for resilient, high-capacity systems.
  • Industrial-ready thermal range: Rated for -40 °C to 105 °C operation to support deployment in rugged and industrial environments.
  • Flexible power domains: Multiple core and I/O voltage options support diverse board-level power architectures and integration scenarios.

Why Choose MPC8569CVJAQLJB?

The MPC8569CVJAQLJB is positioned as a highly integrated embedded processor that brings together robust packet and protocol handling, on-chip security acceleration and reliable memory subsystems in a single 783-pin FC-PBGA package. Its combination of PowerPC e500v2 processing, QUICC Engine communications, hardware crypto and ECC-protected DDR controllers makes it suited to demanding networking, telecom and industrial applications.

Engineers designing systems that require consolidated connectivity, security and memory reliability will find the MPC8569CVJAQLJB appropriate for scalable, long-lived deployments where industrial temperature operation and reduced system complexity are important considerations.

Request a quote or submit an inquiry to evaluate availability and pricing for the MPC8569CVJAQLJB and discuss how it fits your design requirements.

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