MPC8560VT667LB

The MPC8560VT667LB is a single‑core PowerPC e500 microprocessor operating at 667 MHz, packaged in a 783‑FCPBGA (29×29) surface‑mount package. It integrates a PowerPC processor core with system logic and communications peripherals targeted at networking, telecommunications, and wireless infrastructure applications.

As a member of the PowerQUICC III family, the device combines embedded Power Architecture processing with integrated interfaces and memory controllers to support high‑throughput communication designs and consumer‑grade applications.

Key Features

• PowerPC e500 Core (667 MHz) Single 32‑bit core running at 667 MHz delivering deterministic embedded processing for communication tasks.
• On‑chip Caches and MMU 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; caches can be locked entirely or on a per‑line basis. Includes a memory management unit designed for embedded use.
• Communications Processor Module (CPM) Integrated CPM for communications offload and protocol handling; CPM is specified in the product family documentation for high‑performance communications processing.
• Memory Controllers Integrated controllers for DDR and SDRAM to support system memory requirements for packet buffering and application code.
• High‑Speed Ethernet Two 10/100/1000 Mbps Ethernet MACs to support multi‑port networked designs and gigabit connectivity.
• Peripheral and System Interfaces Support for I2C, JTAG, PCI/PCI‑X and RapidIO as described in the series documentation, enabling flexible system integration and debug.
• Package and Mounting 783‑FCPBGA (29×29) package in a surface‑mount form factor suitable for compact embedded boards.
• Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance for environmental compatibility.

Typical Applications

• Networking Equipment Use as a communications processor for routers, switches, and network appliances that require dual gigabit Ethernet and integrated memory interfaces.
• Telecommunications Infrastructure Suitable for telecom systems and line cards that need embedded Power Architecture processing and CPM‑based protocol handling.
• Wireless Infrastructure Designed for base station and wireless backhaul modules requiring high‑throughput packet processing and reliable system logic integration.
• Embedded Communications Modules Ideal for OEM embedded modules and appliances that consolidate CPU and communication peripherals into a single device.

Unique Advantages

• Integrated Communications and System Logic: Combines a PowerPC e500 core with CPM and multiple high‑speed interfaces, reducing BOM and board complexity.
• Deterministic Embedded Performance: Single 32‑bit core at 667 MHz with configurable caches and an embedded MMU for predictable application behavior.
• Dual Gigabit Ethernet: Two 10/100/1000 Mbps MACs provide native support for multi‑port networked designs without external MAC components.
• Flexible Memory Support: On‑chip DDR and SDRAM controllers simplify system memory design for packet buffering and application storage.
• Compact, Assembly‑Ready Package: 783‑FCPBGA (29×29) surface‑mount package enables high‑density board layouts for space‑constrained systems.
• RoHS Compliant and Consumer Qualified: Meets environmental compliance and is specified for consumer‑grade operating conditions.

Why Choose MPC8560VT667LB?

The MPC8560VT667LB positions itself as a highly integrated embedded communications processor combining a PowerPC e500 core, on‑chip memory controllers, CPM communications support, and dual gigabit Ethernet MACs. This integration helps simplify board design and shortens time to market for networking, telecom, and wireless infrastructure products.

Engineers and procurement teams building consumer‑grade embedded systems will find the MPC8560VT667LB suitable for designs that require compact packaging, robust communications interfaces, and the system‑level capabilities described in the PowerQUICC III family documentation.

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