MPC8560VT667LC

The MPC8560VT667LC is a PowerPC e500 microprocessor IC featuring a single 32-bit core running at 667 MHz in a 783-FCPBGA (29×29) package. It is a member of the PowerQUICC III family and integrates processor and system logic for embedded networking, telecommunications, and wireless infrastructure applications.

Designed for embedded communications designs, the device combines on-chip connectivity and controllers—such as gigabit Ethernet MACs, CPM co-processor support, and DDR/SDRAM memory controllers—with caching and debug features to deliver a compact, system-level solution.

Key Features

• Core PowerPC e500 architecture, single 32-bit core at 667 MHz with integrated MMU and embedded debug support.
• L1 Caches 32 KB instruction cache and 32 KB data cache with parity protection; caches can be locked entirely or on a per-line basis.
• Communications Processor Module (CPM) High-performance RISC CPM for communications tasks, noted in documentation as operating up to 333 MHz and providing software compatibility with previous PowerQUICC families.
• Memory Controllers Integrated controllers for DDR and SDRAM memory types for system memory interfacing.
• Ethernet Two 10/100/1000 Mbps MACs for multi-port gigabit Ethernet connectivity.
• Interfaces and I/O On-chip support for I2C, JTAG, Local Bus, PCI/PCI‑X and RapidIO as described in the product documentation, enabling broad peripheral interconnect options.
• System Services Integrated DMA controller and system logic to support networking and telecommunications use cases.
• Package & Mounting 783-FCPBGA (29×29) package, surface-mount mounting type.
• Operating Range & Compliance Rated for 0 °C to 105 °C operating temperature and RoHS compliant; device qualification listed as Consumer.

Typical Applications

• Networking Equipment Use as a system processor in routers, switches, and other networking gear that require integrated gigabit Ethernet MACs and communications processors.
• Telecommunications Infrastructure Suited for telecom line cards and infrastructure modules that need on-chip controllers and CPM-based communications handling.
• Wireless Infrastructure Applicable to wireless base-station and backhaul equipment where integrated system logic and high-speed interfaces simplify board design.
• Embedded Communications Systems Ideal for embedded designs that benefit from combined processor, memory controllers, and peripheral interfaces in a single package.

Unique Advantages

• Highly integrated communications engine: Combines a PowerPC e500 core with CPM support, dual gigabit Ethernet MACs, and memory controllers to reduce external components and BOM complexity.
• Deterministic embedded core performance: Single 32-bit e500 core at 667 MHz with MMU and cache locking options for predictable real-time behavior.
• Rich peripheral connectivity: On-chip support for I2C, JTAG, Local Bus, PCI/PCI‑X and RapidIO provides flexible system interconnect options.
• Embedded communications offload: CPM and DMA resources enable offloading of protocol handling and data movement from the main core.
• Thermal and packaging suitability: 783-FCPBGA (29×29) surface-mount package rated for 0 °C to 105 °C, supporting compact system designs.
• Standards-oriented documentation: Backed by PowerQUICC III family documentation and an integrated processor hardware reference to support design and validation.

Why Choose MPC8560VT667LC?

The MPC8560VT667LC positions itself as a compact, system‑level processor for embedded communications designs that need a balance of processing performance, integrated connectivity, and memory interfacing. Its PowerPC e500 core, combined with CPM resources and dual gigabit Ethernet MACs, makes it appropriate for networking, telecommunications, and wireless infrastructure applications where board-level integration is important.

With on-chip memory controllers, a range of peripheral interfaces, and detailed technical documentation, this device supports designs focused on integration, predictable embedded performance, and long-term maintainability within systems that align with the device’s consumer qualification and operating temperature range.

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