MPC8560PX833LB

The MPC8560PX833LB is a single-core PowerPC e500 microprocessor in the MPC85xx family, running at 833 MHz in a 783‑FCPBGA (29×29) package. It integrates the PowerQUICC III family system logic and communications peripherals targeted for embedded networking, telecommunications and wireless infrastructure applications.

Designed to combine a high-performance 32‑bit Book E–enhanced core with integrated controllers and communications engines, the device targets system designs that require on-chip memory interfaces, multi‑speed Ethernet, and communications co‑processing.

Key Features

• Core PowerPC e500 32‑bit core, single core at 833 MHz with embedded architecture features described in the MPC8560 family documentation.
• Caches and MMU On‑chip instruction and data caches (32 KB each) and an embedded memory management unit designed for embedded applications.
• Communications Co-processor (CPM) Integrated Communications Processor Module for protocol handling and communications tasks; CPM architecture and compatibility are part of the MPC8560 design.
• Memory Controllers On‑chip controllers for DDR and SDRAM to support system memory interfacing.
• Ethernet Two 10/100/1000 Mbps Ethernet interfaces for multi‑port network connectivity.
• Peripheral Interfaces I²C controller and additional system interfaces outlined in the MPC8560 documentation for board‑level integration.
• System Controllers Integrated support for PCI/PCI‑X and RapidIO as described in the device reference material.
• Package and Mounting 783‑FCPBGA supplier device package (29×29 mm), surface mount construction suitable for embedded board designs.
• Operating Range Rated for operation from 0 °C to 105 °C for consumer‑grade applications.
• Compliance RoHS‑compliant material status.

Typical Applications

• Networking Equipment Use in routers, switches and network appliances that require dual gigabit Ethernet and integrated packet handling.
• Telecommunications Systems Suitable for telecom infrastructure elements leveraging the PowerQUICC III integrated communications features and CPM support.
• Wireless Infrastructure Deployment in wireless access and base station equipment that benefit from on‑chip memory controllers and communications peripherals.
• Embedded Communications Appliances Ideal for embedded designs that need a single high‑performance PowerPC e500 core with system‑level interfaces on chip.

Unique Advantages

• Integrated Communications Subsystem: Combines a PowerPC e500 core with CPM and multiple on‑chip controllers, reducing external component count for communications‑centric designs.
• Dual Gigabit Ethernet: Two 10/100/1000 Mbps Ethernet interfaces enable multi‑port or uplink/downlink configurations without additional MAC devices.
• On‑board Memory Support: DDR and SDRAM controller integration simplifies memory subsystem design and board layout.
• Embedded‑Oriented Core Features: 32 KB L1 instruction and 32 KB L1 data caches with MMU and debug facilities provide deterministic embedded performance and development visibility.
• Robust Packaging and Thermal Range: 783‑FCPBGA (29×29) surface‑mount package with 0 °C to 105 °C operating range supports typical embedded deployment environments.
• Standards‑Oriented Interfaces: Support for PCI/PCI‑X, RapidIO and I²C as documented enables integration with common board‑level ecosystems.

Why Choose MPC8560PX833LB?

The MPC8560PX833LB positions itself as a purpose‑built embedded communications processor that pairs a PowerPC e500 833 MHz core with the system logic and peripheral set characteristic of the PowerQUICC III family. It targets engineers designing networking, telecom and wireless infrastructure equipment who need integrated Ethernet, memory controllers and communications co‑processing in a single device.

Backed by NXP Semiconductors’ MPC8560 product documentation and RoHS compliance, this device offers a consolidated platform for designs that prioritize integrated communications features, established architectural building blocks, and a surface‑mount 783‑FCPBGA package for production board assembly.

Request a quote or submit an RFQ to receive pricing and availability for the MPC8560PX833LB and to discuss your volume, lead time, and packaging requirements.