MPC8560PX667LC

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 249 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A991B4BEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed667MHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of MPC8560PX667LC – IC MPU MPC85XX 667MHZ 783FCPBGA

The MPC8560PX667LC is a PowerPC e500 single‑core 32‑bit microprocessor running at 667 MHz, part of the PowerQUICC III family. It integrates processor core functionality with system logic tailored for networking, telecommunications, and wireless infrastructure applications.

Designed for embedded communications systems, the device provides on‑chip support for memory controllers, dual Ethernet MACs, a communications processor module (CPM), and industry‑standard interfaces to simplify system design and shorten development time.

Key Features

  • Core and Architecture  Single PowerPC e500 32‑bit core at 667 MHz with a Book E–enhanced architecture for embedded applications.
  • L1 Caches  32 KB instruction cache and 32 KB data cache with parity protection and cache locking options for deterministic performance.
  • Communications Processor (CPM)  Integrated CPM operating at up to 333 MHz for communications and protocol offload; maintains software compatibility with prior PowerQUICC families.
  • Memory Controllers  Integrated controllers for DDR and SDRAM to support system memory needs.
  • Ethernet  Two 10/100/1000 Mbps Ethernet MACs for high‑throughput networking connectivity.
  • Interfaces and Peripherals  On‑chip support for I2C, JTAG, PCI/PCI‑X, RapidIO and local bus interfaces as referenced in the integrated processor documentation.
  • Package and Mounting  783‑FCPBGA (29 × 29 mm) package, surface mount.
  • Operating Temperature  Rated for 0 °C to 105 °C operation.
  • Standards and Compliance  RoHS compliant.

Typical Applications

  • Networking and Communications Infrastructure  System logic and dual gigabit Ethernet support make the device suitable for embedded networking equipment and communication appliances.
  • Telecommunications Systems  Integrated CPM and protocol support target telecom infrastructure where embedded packet processing is required.
  • Wireless Infrastructure  On‑chip communications features and industry‑standard interfaces support base station and wireless backbone applications.
  • Embedded Power Architecture Designs  Single‑core PowerPC e500 implementations for embedded systems requiring deterministic performance and integrated I/O.

Unique Advantages

  • Integrated Communications Logic: The MPC8560 combines a PowerPC core with system logic and a CPM, reducing external components for communications designs.
  • Deterministic Cache Control: 32 KB instruction and 32 KB data caches with locking and parity provide predictable performance and error detection.
  • High Connectivity: Two 10/100/1000 Mbps Ethernet MACs plus multiple industry interfaces simplify high‑bandwidth system designs.
  • Flexible Memory Support: On‑chip DDR and SDRAM controllers allow direct connection to common system memory types.
  • Robust Packaging and Thermal Range: 783‑FCPBGA package and 0 °C to 105 °C rating support embedded system thermal requirements.
  • Regulatory Compliance: RoHS compliance supports environmental requirements for modern electronics manufacturing.

Why Choose MPC8560PX667LC?

The MPC8560PX667LC positions itself as a single‑core PowerPC e500 solution that integrates processor performance with the system logic required for embedded networking and communications applications. Its on‑chip CPM, dual gigabit Ethernet capability, and memory controller integration reduce board complexity and BOM for communications and infrastructure designs.

Backed by NXP Semiconductors' PowerQUICC III lineage and supported by comprehensive documentation, the MPC8560PX667LC is suited to engineers and procurement teams building embedded communications systems that require established Power Architecture technology with integrated I/O and connectivity.

Request a quote or submit an RFQ to check availability and pricing for the MPC8560PX667LC. Our team can provide lead‑time and ordering information to support your design schedule.

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