MPC855TZQ80D4

IC MPU MPC8XX 80MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 80MHz 357-PBGA (25x25)

Quantity 1,610 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed80MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TZQ80D4 – IC MPU MPC8XX 80MHz 357BGA

The MPC855TZQ80D4 is a 32-bit microprocessor IC from the MPC855 series, featuring a single MPC8xx core running at 80 MHz. Designed for embedded applications, it integrates communications-focused co-processing (CPM) and multiport Ethernet support to address networking and controller use cases in consumer and embedded systems.

This device offers a compact 357‑PBGA (25×25) surface-mount package, 3.3 V I/O compatibility, and a commercial operating range, providing a balanced combination of integration and board-level efficiency for embedded designs.

Key Features

  • 32‑bit Single Core (MPC8xx)  The processor implements a single 32‑bit MPC8xx core at 80 MHz for deterministic embedded control tasks.
  • Communications Co‑processors (CPM)  Integrated communications co‑processors for offloading protocol handling and serial communications tasks.
  • Ethernet Connectivity  Dual Ethernet capability with one 10 Mbps port and one 10/100 Mbps port to support networked applications.
  • Memory Controller  On‑chip DRAM controller simplifies system memory interfacing for typical embedded memory configurations.
  • Serial Protocol Support  Additional interfaces include HDLC/SDLC for framed serial communications and protocol handling.
  • Supply and Mounting  3.3 V I/O and surface‑mount 357‑PBGA (25×25) package for compact board layouts.
  • Operating Range  Commercial temperature rating from 0 °C to 95 °C suitable for consumer and general embedded environments.
  • Regulatory  RoHS compliant for lead‑free manufacturing and regulatory alignment.
  • Graphics  No graphics acceleration—optimized for communications and control rather than multimedia processing.

Typical Applications

  • Embedded Networking Devices  Use the integrated CPM and Ethernet ports for compact network controllers, gateways, and protocol converters.
  • Communications Equipment  Offload serial and framed‑protocol tasks (HDLC/SDLC) to the CPM for telecommunications and connectivity modules.
  • Industrial and Consumer Controllers  Leverage the 32‑bit core and DRAM controller for appliance control, instrumentation, and general embedded control systems.

Unique Advantages

  • Integrated Communications Engine  CPM and HDLC/SDLC interfaces reduce external logic and simplify designs that require robust serial protocol handling.
  • Dual Ethernet Ports  On‑device 10 Mbps and 10/100 Mbps Ethernet support enables direct network connectivity without additional PHY complexity.
  • Compact PBGA Footprint  357‑PBGA (25×25) package helps minimize PCB area for space‑constrained embedded systems.
  • Single 3.3 V I/O Rail  Standard 3.3 V I/O eases power‑rail design and compatibility with common peripheral components.
  • RoHS Compliant  Suits lead‑free assembly processes and environmental compliance requirements.
  • Commercial Temperature Range  0 °C to 95 °C rating targets consumer and general industrial applications.

Why Choose MPC855TZQ80D4?

The MPC855TZQ80D4 positions itself as a communications‑oriented embedded microprocessor, combining a 32‑bit MPC8xx core with CPM co‑processor support and multiport Ethernet to streamline networked control designs. Its DRAM controller and serial protocol interfaces make it suitable for applications that require integrated communications handling without extensive external logic.

This part is appropriate for designers seeking a compact, RoHS‑compliant solution with a proven embedded feature set for consumer and general embedded products, offering predictable operating behavior across the specified commercial temperature range.

Request a quote or submit a procurement inquiry to receive pricing, availability, and technical ordering information for the MPC855TZQ80D4.

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