MPC855TZQ50D4R2
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 675 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC855 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC855TZQ50D4R2 – 32‑Bit 50 MHz MPC8xx Microprocessor, 357‑PBGA (25×25)
The MPC855TZQ50D4R2 is a single‑core, 32‑bit microprocessor in the MPC8xx family designed for embedded applications that require integrated communications capability. With a 50 MHz core and on‑chip communications co‑processor (CPM), it targets embedded and networking use cases where integrated I/O and protocol handling are important.
Built for systems operating on a 3.3 V I/O domain and supplied in a compact 357‑PBGA (25×25) surface‑mount package, this device balances processing capability, communications features and a board‑level footprint suited for consumer‑grade embedded products.
Key Features
- Core and Performance: Single 32‑bit MPC8xx core running at 50 MHz for deterministic embedded control and protocol processing.
- Communications Co‑processor (CPM): Integrated communications processing module suitable for offloading protocol handling and real‑time data paths.
- Memory Interface: DRAM controller support for system memory integration and flexible memory configurations.
- Ethernet Interfaces: Dual Ethernet support with one 10 Mbps port and one 10/100 Mbps port to enable basic network connectivity and uplink options.
- Serial and Protocol Interfaces: Additional HDLC/SDLC protocol interfaces for serial protocol framing and line control.
- Voltage and Mounting: 3.3 V I/O operation and surface‑mount 357‑PBGA (25×25) package for compact board designs.
- Operating Range: Rated for operation from 0 °C to 95 °C, suitable for consumer‑grade embedded environments.
- Environmental Compliance: RoHS compliant to meet modern manufacturing and disposal standards.
- Qualification: Consumer‑qualified device for consumer electronics and embedded product lines.
Typical Applications
- Embedded Networking Equipment: Use the integrated Ethernet ports and CPM to implement basic network interface and protocol handling.
- Communications Controllers: Ideal for embedded controllers that require dedicated serial protocol support such as HDLC/SDLC and offloaded communications processing.
- Consumer Embedded Devices: Suited for consumer electronics and appliances where a compact 357‑PBGA package and consumer qualification are required.
Unique Advantages
- Integrated Communications Processing: On‑chip CPM provides dedicated handling of communications tasks, reducing system software complexity and CPU load.
- Dual Ethernet Options: One 10 Mbps and one 10/100 Mbps interface enable flexible connectivity and uplink choices without additional PHYs on some designs.
- Compact Package: 357‑PBGA (25×25) surface‑mount package minimizes board space while supporting necessary I/O.
- Standard 3.3 V I/O: Common I/O voltage simplifies interfacing with modern peripherals and memory components.
- RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.
- Consumer Qualification: Designed and specified for consumer product deployment and related lifecycle considerations.
Why Choose MPC855TZQ50D4R2?
The MPC855TZQ50D4R2 positions itself as a pragmatic, communications‑oriented 32‑bit microprocessor for embedded designs that need integrated protocol handling, Ethernet connectivity and DRAM interfacing in a compact package. Its single MPC8xx core at 50 MHz, combined with the CPM and serial protocol support, makes it well suited to designers building consumer‑grade networking and embedded communications devices.
Backed by NXP Semiconductors and derived documentation for the MPC8xx family, this device offers a clear specification set for procurement and system integration where a balance of integration, footprint and predictable operating range is required.
Request a quote or submit an inquiry to confirm availability, pricing and lead times for the MPC855TZQ50D4R2.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016