MPC855TZQ50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 1,027 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TZQ50D4 – IC MPU MPC8XX 50MHZ 357BGA

The MPC855TZQ50D4 is a single‑core, 32‑bit MPC8xx microprocessor running at 50 MHz from NXP Semiconductors, supplied in a 357‑pin PBGA (25×25) package. Designed for embedded communications and networking applications, the device integrates a communications processor module (CPM) and DRAM controller capabilities to simplify system design.

With integrated Ethernet interfaces, HDLC/SDLC support and a 3.3 V I/O voltage, this MPU targets consumer‑grade embedded products that require deterministic processor control and communications handling within a 0 °C to 95 °C operating range.

Key Features

  • Core and Performance Single 32‑bit MPC8xx core operating at 50 MHz, providing deterministic processing for embedded control and communications tasks.
  • Power and I/O 3.3 V I/O voltage standard, suitable for common embedded system power domains.
  • Communications Coprocessor (CPM) Integrated communications coprocessor functionality for offloading protocol and data‑stream tasks from the CPU.
  • Memory Support Built‑in DRAM controller support to interface with system memory types commonly used in embedded designs.
  • Ethernet Connectivity Dual Ethernet capability with one 10 Mbps interface and one 10/100 Mbps interface to support wired network connectivity and bridging tasks.
  • Serial and Protocol Interfaces HDLC/SDLC support for synchronous serial protocol implementations and legacy communications links.
  • Package and Mounting 357‑pin PBGA (25×25) package; surface‑mount device optimized for compact embedded PCBs.
  • Operating Range and Qualification Consumer‑qualified device rated for operation from 0 °C to 95 °C and RoHS compliant.

Typical Applications

  • Consumer Networking Equipment Use the integrated Ethernet interfaces and CPM to implement home routers, gateways, and networked consumer appliances that require protocol handling and packet processing.
  • Embedded Communications Controllers Suitable for devices that need dedicated communications offload such as protocol converters, terminal controllers, or media gateways.
  • Protocol and Serial Link Processing Leverage HDLC/SDLC support and the CPM for synchronous serial communications and legacy link integration in consumer systems.

Unique Advantages

  • Integrated Communications Coprocessor Offloads protocol and data‑stream work from the CPU, simplifying software architecture and improving task separation.
  • Dual Ethernet Support One 10 Mbps and one 10/100 Mbps Ethernet interface enable flexible network topologies and mixed‑speed connectivity.
  • Compact PBGA Footprint 357‑pin PBGA (25×25) package reduces board space while accommodating extensive I/O for embedded systems.
  • Standard 3.3 V I/O Aligns with common embedded power rails for straightforward integration into existing designs.
  • RoHS Compliant, Consumer Qualified Meets environmental compliance requirements and is targeted for consumer market deployments within the specified temperature range.

Why Choose MPC855TZQ50D4?

The MPC855TZQ50D4 combines a proven MPC8xx 32‑bit core with integrated communications resources and DRAM controller support to deliver a compact, documented microprocessor solution for embedded communications and consumer networking products. Its dual Ethernet capability and CPM make it a practical choice where protocol handling and network interfacing are central to the design.

Produced by NXP Semiconductors and accompanied by hardware specification documentation for the MPC8xx family, the MPC855TZQ50D4 is suitable for engineers seeking a documented, RoHS‑compliant MPU option for consumer‑grade embedded communications systems operating up to 95 °C.

Request a quote or submit a pricing inquiry to evaluate the MPC855TZQ50D4 for your next embedded communications design.

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