MPC855TVR50D4R2

The MPC855TVR50D4R2 is a single-core 32-bit microprocessor based on the MPC8xx family, operating at 50 MHz. It integrates a communications-oriented co-processor (CPM) and DRAM controller functionality, making it suitable for embedded communications and networking applications.

Designed for embedded and consumer markets, this device delivers integrated Ethernet interfaces and HDLC/SDLC protocol support in a compact 357-PBGA (25×25) surface-mount package while operating from a 3.3 V I/O domain and an ambient range of 0 °C to 95 °C.

Key Features

• Core – Single MPC8xx 32-bit core running at 50 MHz, providing deterministic processing for embedded tasks.
• Communications Co-processor (CPM) – Integrated communications-oriented CPM to offload protocol handling and support communications DSP functions.
• Memory Support – On-chip DRAM controller to interface with external DRAM devices for system memory needs.
• Ethernet – Dual Ethernet capability with one 10 Mbps interface and one 10/100 Mbps interface for network connectivity and segregation of traffic.
• Serial Protocols – HDLC/SDLC support for serial link and protocol framing requirements.
• Power and I/O – 3.3 V I/O signaling to match common legacy and modern embedded peripherals.
• Package & Mounting – 357-PBGA (25×25) package in a surface-mount form factor for compact board designs.
• Operating Range – Rated for operation from 0 °C to 95 °C for consumer-class deployments.
• Environmental – RoHS compliant, meeting common environmental and lead-free requirements.

Typical Applications

• Embedded Communications Equipment – Offload protocol processing and manage network interfaces using the integrated CPM and Ethernet ports.
• Networking Appliances – Implement control-plane or management functions that require an integrated Ethernet interface and HDLC/SDLC support.
• Protocol Gateways – Use the on-chip CPM and serial protocol support to bridge and handle legacy serial links and framed data streams.

Unique Advantages

• Integrated Communications Module: The CPM provides dedicated communications processing, reducing software overhead on the main CPU.
• Dual Ethernet Interfaces: One 10 Mbps and one 10/100 Mbps interface offer flexible network connectivity for segregated control and data paths.
• Compact PBGA Package: The 357-PBGA (25×25) keeps board space small while supporting surface-mount assembly processes.
• DRAM Controller On‑Chip: Built-in DRAM controller simplifies memory subsystem design and accelerates time-to-market.
• Consumer Market Qualification: Product designated for consumer qualification, suited to a wide range of embedded consumer applications.
• RoHS Compliance: Conforms to environmental requirements for lead-free manufacturing.

Why Choose MPC855TVR50D4R2?

The MPC855TVR50D4R2 combines a 32-bit MPC8xx core with an integrated communications processor and DRAM controller to deliver a balanced solution for embedded communications and networking designs. Its dual Ethernet interfaces and HDLC/SDLC support make it well suited to systems that require protocol handling and moderate network throughput in a compact surface-mount package.

As part of the MPC8xx/PowerQUICC family from NXP Semiconductors, this device benefits from established documentation and family-level design resources, providing designers with a consistent platform for developing robust embedded communications systems.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC855TVR50D4R2 and discuss how it can fit into your next embedded communications design.