MPC855TCVR50D4R2

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 753 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TCVR50D4R2 – IC MPU MPC8XX 50MHZ 357BGA

The MPC855TCVR50D4R2 is a single-core, 32-bit microprocessor from the MPC8xx family, specified at 50 MHz and designed for embedded communications and industrial applications. It integrates communications co-processing, DRAM control and Ethernet interfaces to deliver a compact, industrial-grade processing building block for networked and embedded systems.

Key Features

  • Core  Single 32-bit MPC8xx core running at 50 MHz, suitable for deterministic embedded processing tasks.
  • Communications Co-processor (CPM)  Integrated CPM for offloading communications and protocol processing, enhancing system-level throughput for protocol-heavy applications.
  • Memory Controller  Built-in DRAM controller to support external memory configurations required by embedded operating environments.
  • Ethernet Interfaces  Provides one 10 Mbps and one 10/100 Mbps Ethernet interface for network connectivity and varied PHY link speeds.
  • Serial Protocol Support  Additional interfaces including HDLC/SDLC support for synchronous serial communications.
  • Power and I/O  3.3 V I/O voltage for compatibility with common embedded peripherals and interface components.
  • Package and Mounting  Surface-mount 357-pin PBGA in a 25×25 mm footprint for compact board-level integration.
  • Industrial Temperature Range  Rated for −40 °C to 95 °C operation to meet demanding environmental requirements.
  • Regulatory  RoHS compliant, supporting environmental and manufacturing requirements.

Typical Applications

  • Embedded Communications Equipment  Use as the processing core in routers, gateways or protocol converters where integrated CPM and Ethernet interfaces are required.
  • Industrial Control Systems  Suitable for PLCs, motor controllers or remote I/O where the industrial temperature rating and DRAM controller are important.
  • Networked Monitoring and Telemetry  Ideal for data acquisition nodes and telemetry devices that need deterministic processing and both 10 Mbps and 10/100 Mbps connectivity.
  • Legacy and Protocol-Specific Devices  Appropriate for designs that require HDLC/SDLC support and dedicated communications offload.

Unique Advantages

  • Integrated Communications Processing: On-chip CPM co-processor reduces host CPU load for protocol handling and communications tasks.
  • Dual Ethernet Capability: Combines a 10 Mbps and a 10/100 Mbps Ethernet interface to support mixed network link requirements.
  • Industrial Qualification: −40 °C to 95 °C operating range enables deployment in harsh or temperature-variable environments.
  • Compact PBGA Package: 357-pin PBGA (25×25 mm) minimizes PCB area while exposing rich I/O and memory interfaces.
  • Standard 3.3 V I/O: Simplifies integration with common embedded peripherals and reduces the need for level translation.
  • RoHS Compliant: Meets lead-free manufacturing and environmental compliance requirements.

Why Choose MPC855TCVR50D4R2?

The MPC855TCVR50D4R2 combines a 32-bit MPC8xx core with integrated communications co-processing, DRAM support and dual Ethernet interfaces to deliver a balanced, industrial-grade solution for embedded networking and control applications. Its surface-mount 357-PBGA package and 3.3 V I/O provide a compact, easily integrated platform for space-constrained designs.

This part is well suited to engineers building communications equipment, industrial controllers, and networked embedded devices that require reliable operation across a broad temperature range and the communications flexibility afforded by HDLC/SDLC and multiple Ethernet interfaces.

Request a quote or submit a sales inquiry to get pricing, lead time and availability for the MPC855TCVR50D4R2.

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