MPC855TCVR50D4R2
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 753 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC855 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10Mbps (1), 10/100Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 50MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 3.3V |
Overview of MPC855TCVR50D4R2 – IC MPU MPC8XX 50MHZ 357BGA
The MPC855TCVR50D4R2 is a single-core, 32-bit microprocessor from the MPC8xx family, specified at 50 MHz and designed for embedded communications and industrial applications. It integrates communications co-processing, DRAM control and Ethernet interfaces to deliver a compact, industrial-grade processing building block for networked and embedded systems.
Key Features
- Core Single 32-bit MPC8xx core running at 50 MHz, suitable for deterministic embedded processing tasks.
- Communications Co-processor (CPM) Integrated CPM for offloading communications and protocol processing, enhancing system-level throughput for protocol-heavy applications.
- Memory Controller Built-in DRAM controller to support external memory configurations required by embedded operating environments.
- Ethernet Interfaces Provides one 10 Mbps and one 10/100 Mbps Ethernet interface for network connectivity and varied PHY link speeds.
- Serial Protocol Support Additional interfaces including HDLC/SDLC support for synchronous serial communications.
- Power and I/O 3.3 V I/O voltage for compatibility with common embedded peripherals and interface components.
- Package and Mounting Surface-mount 357-pin PBGA in a 25×25 mm footprint for compact board-level integration.
- Industrial Temperature Range Rated for −40 °C to 95 °C operation to meet demanding environmental requirements.
- Regulatory RoHS compliant, supporting environmental and manufacturing requirements.
Typical Applications
- Embedded Communications Equipment Use as the processing core in routers, gateways or protocol converters where integrated CPM and Ethernet interfaces are required.
- Industrial Control Systems Suitable for PLCs, motor controllers or remote I/O where the industrial temperature rating and DRAM controller are important.
- Networked Monitoring and Telemetry Ideal for data acquisition nodes and telemetry devices that need deterministic processing and both 10 Mbps and 10/100 Mbps connectivity.
- Legacy and Protocol-Specific Devices Appropriate for designs that require HDLC/SDLC support and dedicated communications offload.
Unique Advantages
- Integrated Communications Processing: On-chip CPM co-processor reduces host CPU load for protocol handling and communications tasks.
- Dual Ethernet Capability: Combines a 10 Mbps and a 10/100 Mbps Ethernet interface to support mixed network link requirements.
- Industrial Qualification: −40 °C to 95 °C operating range enables deployment in harsh or temperature-variable environments.
- Compact PBGA Package: 357-pin PBGA (25×25 mm) minimizes PCB area while exposing rich I/O and memory interfaces.
- Standard 3.3 V I/O: Simplifies integration with common embedded peripherals and reduces the need for level translation.
- RoHS Compliant: Meets lead-free manufacturing and environmental compliance requirements.
Why Choose MPC855TCVR50D4R2?
The MPC855TCVR50D4R2 combines a 32-bit MPC8xx core with integrated communications co-processing, DRAM support and dual Ethernet interfaces to deliver a balanced, industrial-grade solution for embedded networking and control applications. Its surface-mount 357-PBGA package and 3.3 V I/O provide a compact, easily integrated platform for space-constrained designs.
This part is well suited to engineers building communications equipment, industrial controllers, and networked embedded devices that require reliable operation across a broad temperature range and the communications flexibility afforded by HDLC/SDLC and multiple Ethernet interfaces.
Request a quote or submit a sales inquiry to get pricing, lead time and availability for the MPC855TCVR50D4R2.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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