MPC8555VTAPF
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 381 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8555 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 783-BBGA, FCBGA | RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 833MHz | Supplier Device Package | 783-FCPBGA (29×29) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 2.5V, 3.3V |
Overview of MPC8555VTAPF – IC MPU MPC85XX 833MHZ 783FCPBGA
The MPC8555VTAPF is a single‑core, 32‑bit PowerPC e500 microprocessor running at 833 MHz in a 783‑FCPBGA (29×29) surface‑mount package. It integrates system logic targeted for networking, telecommunications and wireless infrastructure applications and is a member of the PowerQUICC III family of integrated communications processors.
Designed for embedded communications designs, the device combines processor performance with on‑chip memory controllers, multi‑speed Ethernet, USB and serial peripheral support, plus hardware security features to simplify system design and accelerate time to market.
Key Features
- Core PowerPC e500 embedded core, single‑core 32‑bit operation at 833 MHz.
- Core architecture and performance support Dual‑issue superscalar, seven‑stage pipeline with 32 KB L1 instruction cache and 32 KB L1 data cache (parity protected and lockable), single‑precision floating‑point operations, memory management unit, debug support, dynamic power management and performance monitor facility (as described in the PowerQUICC III family documentation).
- Memory controllers On‑chip DDR and SDRAM controllers to support external memory subsystem configurations.
- High‑speed networking Two 10/100/1000 Mbps Ethernet interfaces with three‑speed and MII management support (detailed in the hardware specification).
- Peripheral interfaces Integrated USB 2.0 (1), DUART serial interface, I2C, JTAG and PCI support for common peripheral and debug requirements.
- Communications processor module (CPM) Built‑in communications co‑processor resources to support embedded communications tasks.
- Security features On‑chip cryptography support and a hardware random number generator for secure communications functions.
- Package and environmental 783‑FCPBGA (29×29) package, surface mount; operating temperature range 0 °C to 105 °C; RoHS compliant; consumer qualification.
Typical Applications
- Networking equipment Use the integrated dual Gigabit Ethernet interfaces and CPM to implement networked appliances and communications endpoints.
- Telecommunications systems Leverage on‑chip communications logic and peripheral interfaces for telecom infrastructure equipment.
- Wireless infrastructure Apply the processor and system logic to control and data‑plane functions in wireless backhaul and infrastructure devices.
- Embedded communications platforms Combine DDR/SDRAM memory support, USB 2.0 and serial interfaces for compact, connected embedded designs.
Unique Advantages
- Integrated communications peripherals: On‑chip CPM and multi‑speed Ethernet reduce external component count and simplify board design for communications‑focused systems.
- Hardware security support: Built‑in cryptography and RNG provide foundational security primitives for secure protocol implementations.
- Flexible memory options: DDR and SDRAM controllers enable a range of memory configurations to match performance and capacity requirements.
- PowerQUICC III platform: Member of the PowerQUICC III family with system‑level support and documentation for embedded networking and telecom applications.
- Standard interfaces and debug paths: USB 2.0, I2C, PCI, JTAG and DUART support common peripheral connectivity and development workflows.
- Deployment‑ready package and temperature range: 783‑FCPBGA (29×29) surface mount package, 0 °C to 105 °C operating range and RoHS compliance for streamlined manufacturing.
Why Choose MPC8555VTAPF?
The MPC8555VTAPF offers a focused combination of PowerPC e500 processing capability and integrated system logic tailored to networking, telecommunications and wireless infrastructure applications. Its on‑chip communications resources, memory controllers and hardware security features reduce system complexity and help accelerate development of embedded communications platforms.
This part is suited for engineers and system designers who need a compact, integrated solution that balances processor performance with communications interfaces and security support, backed by the documentation and platform resources of the PowerQUICC III family.
Request a quote or submit an inquiry to evaluate MPC8555VTAPF for your next embedded communications design.

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