MPC855TCVR66D4

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 94 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TCVR66D4 – IC MPU MPC8XX 66MHZ 357BGA

The MPC855TCVR66D4 is a single‑core, 32‑bit MPC8xx microprocessor operating at 66 MHz, designed for cost‑sensitive embedded communications and networking controllers. It combines an MPC8xx general‑purpose core with an integrated Communications Processor Module (CPM) and a dedicated 10/100-Mbps Fast Ethernet controller to consolidate protocol and network processing in a single device.

Targeted at low‑cost networking products such as SOHO routers, ADSL and cable modem equipment, and other telecommunications systems, the MPC855 provides integrated Ethernet, CPM‑based protocol support (ATM, HDLC, QMC), on‑chip FIFO/DMA support, and industrial temperature qualification for robust embedded deployments.

Key Features

  • Core Single MPC8xx 32‑bit core running at 66 MHz for general‑purpose application processing.
  • Communications Processor Module (CPM) Integrated RISC communications processor for offloading protocol tasks; supports ATM, HDLC and the QMC multichannel protocol as described in the product documentation.
  • Ethernet Controller Integrated 10/100‑Mbps Fast Ethernet MAC with on‑chip transmit/receive FIFOs and bursting DMA to support high‑throughput packet handling; supports MII and 10‑Mbps interfaces as documented.
  • Memory and DMA Includes an 8‑KByte dual‑port RAM (as provided for MPC855 devices) plus support for off‑chip buffer descriptor rings to manage external packet buffers.
  • Interfaces Additional interfaces include HDLC/SDLC and support for standard media‑independent Ethernet interfaces (MII and 7‑wire 10‑Mbps where applicable).
  • Power and I/O 3.3 V I/O signaling for standard embedded system integration.
  • Package and Mounting 357‑PBGA (25 × 25 mm) surface‑mount package (357‑BBGA package case).
  • Operating Range & Qualification Industrial operating temperature range of −40 °C to 95 °C and RoHS compliant.

Typical Applications

  • SOHO Routers Consolidates control and packet‑processing functions with integrated Ethernet and CPM protocol support for compact router designs.
  • ADSL and Cable Modems Provides combined application and communication processing suited to low‑cost broadband gateway devices.
  • Telecommunications Controllers Supports multichannel protocol processing (QMC) and ATM features for telecom and access networking equipment.
  • General Networking Appliances Ideal for cost‑sensitive network controllers requiring integrated MAC, DMA and CPM offload capabilities.

Unique Advantages

  • Integrated Communications Subsystems: Combines an MPC8xx application core, CPM and a 10/100‑Mbps Ethernet controller to reduce external components and simplify board design.
  • Protocol Offload Capability: CPM‑based support for ATM, HDLC and QMC enables dedicated protocol processing without consuming the main core for packet handling.
  • On‑chip FIFOs and DMA: Large transmit/receive FIFOs with bursting DMA and off‑chip buffer descriptor rings improve packet throughput and memory management flexibility.
  • Industrial Temperature Qualification: Rated for −40 °C to 95 °C operation, suitable for demanding embedded environments.
  • Standard 3.3 V I/O and PBGA Package: 3.3 V I/O and a 357‑PBGA (25×25) surface‑mount package facilitate integration into existing embedded designs.
  • Manufacturer Support: Provided by NXP Semiconductors with product documentation and a technical summary available for design integration.

Why Choose MPC855TCVR66D4?

The MPC855TCVR66D4 positions itself as a compact, integrated solution for embedded communications and networking equipment where cost, integration and protocol flexibility matter. By combining a 32‑bit MPC8xx core with a CPM and an independent Fast Ethernet controller, it enables designers to consolidate functionality, streamline BOM and offload protocol processing from the main CPU.

With industrial temperature qualification, 3.3 V I/O, and RoHS compliance, this device suits a range of low‑cost networking and telecommunications designs that require deterministic protocol handling and reliable Ethernet connectivity backed by NXP Semiconductors documentation and parts support.

Request a quote or submit an inquiry to purchase the MPC855TCVR66D4 and discuss availability and lead times for your project requirements.

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