MPC8555VTALF

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 860 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8555
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN3A991A2Ethernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed667MHzSupplier Device Package783-FCPBGA (29×29)
USBUSB 2.0 (1)Voltage – I/O2.5V, 3.3V

Overview of MPC8555VTALF – IC MPU PowerPC e500 667 MHz, 783-FCPBGA

The MPC8555VTALF is a single-core PowerPC e500 microprocessor operating at 667 MHz, offered in a 783-ball FCPBGA (29×29) surface-mount package. As a member of the PowerQUICC III family from NXP Semiconductors, the device combines an embedded e500 processor core with integrated system logic targeted at networking, telecommunications and wireless infrastructure applications.

Designed for embedded communications designs, the MPC8555VTALF delivers on-chip interfaces and controllers that simplify system implementation while providing performance, integration and security capabilities for consumer-grade embedded products.

Key Features

  • Core and Architecture  PowerPC e500 32-bit core at 667 MHz; dual-issue superscalar pipeline with a 7-stage design and embedded MMU for embedded application control.
  • Cache and Processing  32 KB L1 instruction cache and 32 KB L1 data cache with parity and lockable cache options; single-precision floating-point supported for algorithm acceleration.
  • Communications Processor Module (CPM)  Integrated CPM and communications co-processor support to offload protocol handling and accelerate communications tasks.
  • Memory Controllers  On-chip controllers for DDR and SDRAM to support system memory requirements.
  • Ethernet and USB  Two three-speed Ethernet interfaces (10/100/1000 Mbps) and one USB 2.0 port to connect high-speed network and peripheral interfaces.
  • Security  Built-in cryptography functions and a hardware random number generator to support secure communications and device authentication schemes.
  • Peripheral Interfaces  DUART and other serial control interfaces along with standard system buses for flexible I/O integration.
  • Power and System Management  Dynamic power management and performance monitoring facilities to optimize power use and measure system behavior.
  • Package and Temperature  783-ball FCPBGA (29×29) surface-mount package; operating temperature range 0 °C to 105 °C. RoHS compliant.

Typical Applications

  • Networking Systems  High-speed interfaces and integrated CPM make the MPC8555VTALF suitable for networking equipment that requires multiple Ethernet ports and robust protocol handling.
  • Telecommunications Equipment  On-chip communications logic and memory controllers support telecom and infrastructure modules that need embedded processing and I/O integration.
  • Wireless Infrastructure  System-level integration and security features support baseband controllers and wireless infrastructure elements requiring reliable embedded processing.
  • Embedded Communications Controllers  Use in embedded controller roles where a compact, single-chip solution with networking, memory and security features reduces board-level complexity.

Unique Advantages

  • Highly Integrated Communications Engine: Combines an e500 core with CPM and communications co-processor support to reduce external logic and simplify system design.
  • Multiport Networking Ready: Two three-speed Ethernet interfaces and USB 2.0 on-chip enable direct connection to network and peripheral devices without extensive glue logic.
  • Embedded-Focused Performance: Dual-issue superscalar core, lockable L1 caches and single-precision floating-point support provide deterministic performance for embedded tasks.
  • Security Primitives On-Chip: Integrated cryptography and a hardware RNG help implement secure communications and protect boot/runtime operations.
  • Memory Flexibility: DDR and SDRAM controllers support a range of system memory configurations for varying throughput and capacity needs.
  • Consumer-Grade Qualification with RoHS Compliance: Consumer qualification and RoHS status enable deployment in consumer embedded products where environmental compliance is required.

Why Choose MPC8555VTALF?

The MPC8555VTALF positions itself as a compact, communications-oriented embedded processor that balances processing capability with integrated system logic for networking and telecommunications applications. Its single PowerPC e500 core, on-chip memory controllers, dual Ethernet ports and security features make it a practical choice for designers aiming to minimize BOM complexity while retaining deterministic embedded performance.

Ideal for teams building consumer-grade embedded communications equipment, the MPC8555VTALF offers scalability within the PowerQUICC III family and provides the documentation and system-level features needed to speed development of networked and telecom-focused products.

Request a quote or submit an inquiry for the MPC8555VTALF to discuss availability, pricing and volume options for your next embedded communications design.

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