MPC855TCVR50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 1,050 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TCVR50D4 – IC MPU MPC8XX 50MHZ 357BGA

The MPC855TCVR50D4 is a member of the MPC8xx microprocessor family from NXP Semiconductors, featuring a single high-performance 32-bit MPC8xx core running at 50 MHz and an integrated communications processor module (CPM). It combines a general-purpose processor with communications acceleration and an on-chip Fast Ethernet controller to address cost-sensitive networking and telecommunications applications.

Designed for embedded networking use cases, the device is well suited to low-cost communications products such as SOHO routers, ADSL and cable modems, and other telecommunications systems requiring integrated Ethernet and protocol processing in an industrial-temperature, surface-mount package.

Key Features

  • Core A single 32-bit MPC8xx core operating at 50 MHz, providing general-purpose application processing.
  • Communications Processor (CPM) Integrated RISC communications processor for offloading protocol processing and handling communications tasks.
  • Ethernet Integrated 10/100-Mbps Fast Ethernet controller with large on-chip FIFOs and bursting DMA; supports 10-Mbps interfaces as well. Full-duplex 100-Mbps operation is supported at the 50 MHz system clock rate.
  • Protocol Support Built-in support for HDLC/SDLC and multichannel protocol processing (QMC), with ATM support noted in the series documentation.
  • Memory and Buffers DRAM controller support and on-chip buffer/FIFO structures for Ethernet and communications use; series devices include an 8-KByte dual-port RAM when available.
  • Power and IO 3.3 V I/O voltage for common embedded system compatibility.
  • Package and Mounting 357-PBGA (25×25) / 357-BBGA package, surface-mount mounting for compact embedded board designs.
  • Operating Range & Qualification Industrial-grade qualification with operating temperature range −40 °C to 95 °C.
  • Compliance RoHS compliant.
  • Graphics Acceleration No graphics acceleration; device focuses on communications and protocol processing functions.

Typical Applications

  • SOHO and Small Router Platforms Integrated Ethernet MAC and CPM make the MPC855TCVR50D4 suitable for consumer and small-office routing appliances requiring onboard protocol handling.
  • ADSL and Cable Modems Targeted for low-cost modem and gateway designs where integrated communications processing and Ethernet connectivity reduce external component count.
  • Telecommunications Systems Support for multichannel protocols, HDLC and ATM in the MPC8xx family enables use in telecom line cards and channelized protocol processors.
  • Embedded Networking Controllers General-purpose embedded networking controllers that require combined CPU and communications acceleration benefit from the device’s integrated CPM and Ethernet features.

Unique Advantages

  • Integrated Communications Subsystem: Combines a high-performance MPC8xx core with an embedded CPM to offload protocol processing and reduce system-level complexity.
  • On-Chip Ethernet with DMA and FIFOs: Built-in 10/100-Mbps MAC with large FIFOs and bursting DMA supports robust Ethernet data paths without excessive external buffering.
  • Protocol Versatility: Native support for HDLC/SDLC and multichannel (QMC) protocols enables a range of telecommunications and networking use cases.
  • Industrial Temperature Range: Qualification for −40 °C to 95 °C provides a wider operating window for deployed embedded systems.
  • Compact, Surface-Mount Package: 357-PBGA (25×25) package allows dense board integration and is suitable for space-constrained designs.
  • RoHS Compliant: Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose MPC855TCVR50D4?

The MPC855TCVR50D4 offers a focused, communications-centric microprocessor solution by integrating a 32-bit MPC8xx core, a dedicated communications processor module, and a 10/100-Mbps Ethernet controller into a single industrial-temperature, surface-mount package. This combination simplifies board design for cost-sensitive networking and telecommunications products while enabling on-chip protocol handling and Ethernet data flow management.

Engineers designing SOHO routers, modems, gateways, and embedded networking controllers will find the MPC855TCVR50D4 appropriate for compact, reliable designs that benefit from reduced BOM and integrated communications capabilities backed by NXP Semiconductors.

If you would like pricing, availability, or to request a quote for the MPC855TCVR50D4, submit your inquiry and our team will respond with a competitive quote and lead-time information.

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