MPC855TCZQ50D4

The NXP Semiconductors MPC855TCZQ50D4 is a 32‑bit MPC8xx microprocessor IC implementing a single 32‑bit core running at 50 MHz. It integrates communications co‑processor functionality (CPM) and DRAM controller capability in a compact 357‑PBGA (25×25) surface‑mount package.

Designed for embedded and industrial applications, this device provides on‑chip communications interfaces including Ethernet and HDLC/SDLC support, and is qualified for industrial temperature operation, making it suitable for networked and controller systems that require extended temperature range and robust I/O.

Key Features

• Core  Single MPC8xx 32‑bit core operating at 50 MHz for deterministic embedded processing.
• Power  3.3 V I/O voltage specification for standard embedded system integration.
• Memory and Controllers  Integrated DRAM controller to support external memory configurations.
• Communications Co‑processor (CPM)  On‑chip communications processing resources to assist protocol handling and offload CPU tasks.
• Ethernet  Two Ethernet interfaces: one 10 Mbps and one 10/100 Mbps, enabling mixed‑speed network connectivity.
• Serial Protocol Support  Additional interfaces include HDLC/SDLC for serial link framing and protocol support.
• Package & Mounting  357‑PBGA (25×25) package, surface‑mount mounting for compact board designs.
• Operating Range & Qualification  Industrial qualification with operating temperature range of -40 °C to 95 °C.
• Compliance  RoHS compliant.
• Graphics  No graphics acceleration (suitable for control and communications tasks rather than graphics‑intensive applications).

Typical Applications

• Embedded Networking Devices  Leverage the dual Ethernet interfaces (10 Mbps and 10/100 Mbps) and CPM for routers, bridges, and other networked controllers.
• Industrial Control Systems  Industrial qualification and -40 °C to 95 °C operation make the MPC855TCZQ50D4 suitable for factory automation and process control equipment.
• Communications Protocol Offload  Use the integrated CPM and HDLC/SDLC support to handle serial protocol framing and reduce host CPU load in communications equipment.
• Embedded Controller Platforms  Compact 357‑PBGA packaging and integrated DRAM controller enable space‑constrained embedded designs requiring reliable I/O and memory support.

Unique Advantages

• Integrated Communications Processing: On‑chip CPM reduces external logic and offloads protocol handling from the main CPU.
• Dual Ethernet Capability: One 10 Mbps and one 10/100 Mbps Ethernet interface provide flexible network connectivity options for mixed‑speed environments.
• Industrial Temperature Qualification: Rated from -40 °C to 95 °C, supporting deployments in demanding environmental conditions.
• Compact PBGA Package: 357‑PBGA (25×25) surface‑mount package enables high‑density board layouts while preserving connectivity and I/O.
• Standards‑friendly I/O Voltage: 3.3 V I/O simplifies interface compatibility with common embedded peripherals.
• RoHS Compliant: Meets regulatory environmental requirements for lead‑free assembly.

Why Choose MPC855TCZQ50D4?

The MPC855TCZQ50D4 combines a single 32‑bit MPC8xx core, integrated communications processing, and DRAM controller functionality in a compact PBGA package, making it a practical choice for embedded designs that require network connectivity and industrial temperature operation. Its onboard Ethernet interfaces and HDLC/SDLC support help simplify board‑level integration for communications and control applications.

This part is well suited to engineering teams developing embedded networking equipment, industrial controllers, and communications appliances that need a robust, RoHS‑compliant processor with dedicated communications resources and extended temperature capability.

Request a quote or submit an inquiry for pricing and availability for the MPC855TCZQ50D4 to evaluate it for your next embedded communications or industrial design.