MPC855TVR50D4

IC MPU MPC8XX 50MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)

Quantity 120 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC855
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A991B4BEthernet10Mbps (1), 10/100Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed50MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O3.3V

Overview of MPC855TVR50D4 – IC MPU MPC8XX 50MHz 357-PBGA

The MPC855TVR50D4 is a single‑core, 32‑bit MPC8xx microprocessor operating at 50 MHz, designed for cost‑sensitive networking and embedded communications applications. It integrates an MPC8xx core, an on‑chip Communications Processor Module (CPM), and a dedicated 10/100-Mbps Fast Ethernet controller to consolidate control and connectivity functions in a compact package.

Targeted use cases include small office/home office (SOHO) routers, ADSL and cable modem controllers, and other general purpose networking devices where integration, predictable interface support, and low system cost are priorities.

Key Features

  • Core – Single MPC8xx 32‑bit core running at 50 MHz for general‑purpose application processing.
  • Communications Processor Module (CPM) – Embedded RISC communications processor for offloading protocol and channel processing tasks, including support for HDLC/SDLC and multichannel protocols.
  • Ethernet Connectivity – Integrated 10/100‑Mbps Fast Ethernet controller with on‑chip FIFOs and bursting DMA; supports multiple physical interfaces including MII and 7‑wire 10‑Mbps interface and operates full‑duplex 100‑Mbps at the 50 MHz system clock.
  • Multichannel & Protocol Support – CPM and QMC protocol support enable multichannel protocol processing, with documented capability to handle time‑division‑multiplexed channels for protocol processing at 50 MHz.
  • Memory Controller – Integrated DRAM controller and provision for on‑chip dual‑port RAM to support communications buffering and shared memory between core and CPM.
  • Interfaces – Additional interface support includes HDLC/SDLC and a communications‑oriented peripheral set appropriate for networking applications.
  • Package & Mounting – 357‑PBGA (25 × 25 mm) surface‑mount package for compact board implementation.
  • Power & Voltage – 3.3 V I/O voltage for common embedded system compatibility.
  • Operating Range & Qualification – Consumer qualification with an operating temperature range of 0 °C to 95 °C; RoHS compliant.

Typical Applications

  • SOHO Routers – Use the integrated Ethernet controller and CPM to handle packet processing, offload protocol tasks, and simplify board design for small network gateways.
  • ADSL and Cable Modems – Integrated communications processing and DRAM controller support modem front‑end buffering and multichannel protocol handling in access network devices.
  • Cost‑Sensitive Networking Equipment – Consolidate control, protocol processing, and Ethernet MAC functions in a single device to reduce BOM and board complexity for entry‑level networking products.
  • Telecommunications Controllers – Leverage CPM multichannel and HDLC/SDLC support for channelized protocol processing and telecom interface tasks.

Unique Advantages

  • Integrated Communications Subsystem: On‑chip CPM plus the MPC8xx core provides dedicated resources for protocol processing and application tasks, reducing the need for external processors.
  • Built‑in 10/100 Mbps Ethernet MAC: Fast Ethernet controller with FIFOs and DMA enables high‑throughput connectivity without taxing the main core.
  • Multichannel Protocol Support: CPM and QMC protocol capabilities enable TDM channel processing and HDLC/SDLC handling suitable for multiport and telecom applications.
  • Compact PBGA Package: 357‑PBGA (25×25) surface‑mount package allows a small PCB footprint for space‑constrained designs.
  • Consumer‑Grade Temperature & Compliance: 0 °C to 95 °C operating range and RoHS compliance meet common requirements for consumer networking products.
  • 3.3 V I/O Compatibility: Standard 3.3 V I/O simplifies integration with common peripherals and PHY devices.

Why Choose MPC855TVR50D4?

The MPC855TVR50D4 combines a 32‑bit MPC8xx core with a dedicated communications processor and an integrated 10/100‑Mbps Ethernet controller to deliver a highly integrated solution for cost‑sensitive networking and communications designs. Its combination of protocol offload, DRAM controller support, and multi‑interface Ethernet capability makes it well suited for SOHO networking equipment, access devices, and embedded telecom controllers.

Manufactured by NXP Semiconductors and provided in a compact 357‑PBGA package, the MPC855TVR50D4 offers designers a packaged, RoHS‑compliant option for scaling embedded networking products while keeping board complexity and component count low.

Request a quote or submit a pricing inquiry to evaluate the MPC855TVR50D4 for your next embedded networking or communications design.

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