MPC8555EVTALF
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 1,846 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8555 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C | ||
| Package / Case | 783-BBGA, FCBGA | RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography, Random Number Generator | Speed | 667MHz | ||
| Supplier Device Package | 783-FCPBGA (29×29) | USB | USB 2.0 (1) | Voltage – I/O | 2.5V, 3.3V |
Overview of MPC8555EVTALF – PowerPC e500 667 MHz Microprocessor
The MPC8555EVTALF is a single‑core PowerPC e500 embedded microprocessor operating at 667 MHz, designed for integrated communications and system‑level applications. It combines an e500 Book E‑compatible core and on‑chip system logic targeted at networking, telecommunications, and wireless infrastructure market segments.
With integrated memory controllers, multiple Ethernet interfaces, security accelerators and communications co‑processors, the MPC8555EVTALF delivers a compact, system‑level building block for embedded communications designs and consumer‑grade applications.
Key Features
- Core PowerPC e500 Book E‑compatible 32‑bit core running at 667 MHz; dual‑issue superscalar design with a 7‑stage pipeline and support for single‑precision floating point operations.
- Memory & Cache Integrated memory controllers for DDR and SDRAM; 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and lockable cache functionality.
- Communications & I/O Two 10/100/1000 Mbps Ethernet interfaces and one USB 2.0 port; Communications Processor Module (CPM) for offloading protocol and peripheral tasks and DUART for serial console connectivity.
- Security & Acceleration On‑chip security co‑processor (SEC) with cryptography acceleration and a hardware random number generator to support secure communications and key operations.
- System Integration Member of the PowerQUICC III family with integrated system logic tailored for networking and telecommunications, reducing external component requirements.
- Debug & Power Enhanced hardware and software debug support, dynamic power management features and a performance monitor facility for system optimization.
- Package & Mounting 783‑FCPBGA (29×29) surface‑mount package (783‑BBGA / FCBGA case) suitable for compact board designs.
- Operating Range & Compliance Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance.
Typical Applications
- Networking Equipment Ideal for switches, routers and access devices that require dual gigabit Ethernet interfaces and integrated communications processing.
- Telecommunications Systems Suited for line cards and communications modules where on‑chip CPM and protocol offload reduce system complexity.
- Wireless Infrastructure Applicable in baseband control and infrastructure nodes that benefit from integrated memory controllers, security acceleration and debug capabilities.
Unique Advantages
- Integrated Communications Subsystem: CPM and on‑chip interfaces consolidate protocol and peripheral support, lowering external component count and board complexity.
- Hardware Security Acceleration: Built‑in cryptography engines and a random number generator speed security operations and enable secure communications without extensive external hardware.
- Memory Flexibility: DDR and SDRAM controller support enables designers to select appropriate memory types for performance and cost targets.
- Developer Visibility and Control: Enhanced debug support and performance monitoring facilitate system bring‑up and optimization.
- Compact, Surface‑Mount Packaging: 783‑FCPBGA (29×29) package supports dense board layouts for space‑constrained designs.
- RoHS Compliant: Conforms to RoHS requirements for environmentally conscious designs.
Why Choose MPC8555EVTALF?
The MPC8555EVTALF positions itself as a system‑level microprocessor for embedded communications, combining a PowerPC e500 core with integrated memory controllers, dual gigabit Ethernet, USB 2.0 and dedicated communications and security co‑processors. As a member of the PowerQUICC III family from NXP Semiconductors, it offers a cohesive platform for designs that require on‑chip protocol support, security acceleration and debug facilities.
This device is suited to engineers developing networking, telecommunications and wireless infrastructure equipment who need a compact, integrated solution that simplifies board design while providing deterministic embedded processing and hardware security features. Its consumer qualification, RoHS compliance and operating range to 105 °C support a broad set of deployment scenarios.
Request a quote or submit an inquiry for pricing and availability of the MPC8555EVTALF to move your project from concept to production.

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