MPC8555EPXALF

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 698 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8555
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A002A1 FREEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed667MHz
Supplier Device Package783-FCPBGA (29×29)USBUSB 2.0 (1)Voltage – I/O2.5V, 3.3V

Overview of MPC8555EPXALF – IC MPU MPC85XX 667MHz 32‑Bit PowerPC e500

The MPC8555EPXALF is a PowerPC e500-based microprocessor from NXP Semiconductors’ MPC8555 series, built for embedded networking, telecommunications and wireless infrastructure applications. It integrates a high-performance 32-bit PowerPC core with system logic and peripheral interfaces to simplify communications-focused system designs.

Running at 667 MHz with integrated memory controllers, security offloads and multi‑speed Ethernet, the device delivers a balanced combination of processing throughput, peripheral integration and system-level features for embedded communications platforms.

Key Features

  • Core: PowerPC e500 32-bit core running at 667 MHz; dual-issue superscalar architecture with a 7-stage pipeline, single-precision floating-point support, and an MMU (as described in the MPC8555E documentation).
  • Caches & Performance: 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection; dynamic power management and performance monitoring facilities referenced in the hardware specification.
  • Memory Support: Integrated controllers for DDR and SDRAM to support system memory requirements for embedded applications.
  • Connectivity: Two 10/100/1000 Mbps Ethernet interfaces and one USB 2.0 port for high-speed network and peripheral connectivity; additional serial DUART interface for console or control links.
  • Co-processors & Offloads: Communications Processor Module (CPM) and Security (SEC) co-processors for communications handling and security acceleration.
  • Security Features: On-chip cryptography capabilities and a Random Number Generator to support secure communications and encrypted workflows.
  • System Interfaces: Rich system-level support documented in the hardware specification including local bus, PCI, I2C and JTAG (see MPC8555E documentation for details).
  • Package & Mounting: 783-ball FCPBGA package (29 × 29 mm) for surface-mount assembly.
  • Operating Range: Rated for operation from 0 °C to 105 °C.
  • Compliance: RoHS compliant.

Typical Applications

  • Networking Equipment: Use the MPC8555EPXALF for routers, switches and gateway platforms requiring integrated Ethernet, high-speed memory support and communications offloads.
  • Telecommunications Systems: Suited for baseband control and infrastructure modules where protocol processing and secure communications are required.
  • Wireless Infrastructure: Deploy in wireless backhaul and edge systems needing integrated connectivity and security acceleration.
  • Security Appliances: Leverage on-chip cryptography and RNG for secure VPN gateways, firewalls and encrypted communications endpoints.

Unique Advantages

  • Integrated Communications Engine: On-chip CPM and system logic reduce external component count and simplify board-level design for communications-centric systems.
  • Hardware Security Offload: SEC co-processor plus cryptography and RNG capabilities offload security tasks from the CPU, improving overall system throughput.
  • Broad Connectivity: Built-in multi‑speed Ethernet interfaces and USB 2.0 support enable flexible network and peripheral integration without extensive external controllers.
  • Embedded Performance: 667 MHz PowerPC e500 core with dedicated L1 caches and MMU provides predictable embedded processing performance documented in the MPC8555E specification.
  • Board-Level Compatibility: Standard 783-FCPBGA surface-mount package (29 × 29 mm) facilitates integration into compact embedded designs.
  • Documented Hardware Platform: Member of the PowerQUICC III family with detailed hardware specification and reference documentation available for system design and validation.

Why Choose MPC8555EPXALF?

The MPC8555EPXALF positions itself as a purpose-built embedded communications processor that combines a PowerPC e500 core with integrated system logic, security features and multi-speed Ethernet connectivity. Its combination of on-chip co-processors, memory interfaces and peripheral support makes it well suited for networking, telecom and wireless infrastructure designs that require both processing and communications integration.

Engineers and procurement teams seeking a RoHS-compliant, surface-mount PowerQUICC III device with documented hardware specifications and embedded-oriented features can leverage the MPC8555EPXALF for designs prioritizing integration, secure communications and predictable embedded performance.

Request a quote or submit an inquiry for availability and pricing of the MPC8555EPXALF to start your procurement process.

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