MPC8555ECPXALF

IC MPU MPC85XX 667MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 667MHz 783-FCPBGA (29x29)

Quantity 22 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8555
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A002A1 FREEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed667MHz
Supplier Device Package783-FCPBGA (29×29)USBUSB 2.0 (1)Voltage – I/O2.5V, 3.3V

Overview of MPC8555ECPXALF – IC MPU MPC85XX 667MHZ 783FCPBGA

The MPC8555ECPXALF is a single‑core PowerPC e500 microprocessor operating at 667 MHz, designed for embedded networking and communications applications. It integrates processor core features and system logic tailored for networking, telecommunications, and wireless infrastructure use.

As a member of the PowerQUICC III family from NXP Semiconductors, the device delivers an integrated platform combining processing performance, communications peripheral support and hardware security features for industrial embedded designs.

Key Features

  • Core PowerPC e500 single core, 32‑bit architecture with dual‑issue superscalar, 7‑stage pipeline and single‑precision floating‑point capability.
  • Caches and MMU 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and lockable cache options; memory management unit optimized for embedded applications.
  • Clock Speed 667 MHz operating frequency for embedded control and communications processing.
  • Communications and Offload Integrated Communications Processor Module (CPM) and communications co‑processors to support protocol handling and offload tasks.
  • Memory Controllers On‑chip controllers for DDR and SDRAM to support external system memory configurations.
  • Networking Interfaces Two 10/100/1000 Mbps Ethernet controllers to support high‑throughput network connectivity.
  • USB and Serial USB 2.0 (1) plus DUART for serial console and peripheral interfacing.
  • Security On‑chip security features including cryptography acceleration and a hardware random number generator (RNG).
  • Package and Mounting 783‑ball FCPBGA package (29×29 mm) designed for surface‑mount assembly.
  • Operating Range and Qualification Industrial qualification with operating temperature range −40°C to 105°C.
  • System and Debug Designed with enhanced hardware and software debug support and performance monitoring facilities.

Typical Applications

  • Network Routers and Switches — Use the integrated dual gigabit Ethernet and CPM to handle packet processing and protocol offload in embedded network equipment.
  • Telecommunications Equipment — Suitable for telecom control and signaling applications that require deterministic embedded processing and communications interfaces.
  • Wireless Infrastructure — Provides processing and security primitives for base station and wireless backhaul systems.
  • Industrial Communications Controllers — Industrial‑rated temperature range and memory interface support make it suitable for rugged communications controllers and gateways.

Unique Advantages

  • Highly integrated communications platform: Combines a PowerPC e500 core with CPM and multiple I/O controllers to reduce external component count and simplify board design.
  • Built‑in security acceleration: Hardware cryptography and RNG support enable secure communications without adding external security engines.
  • Robust networking connectivity: Two integrated gigabit Ethernet controllers provide native high‑speed network interfaces for throughput‑sensitive designs.
  • Industrial temperature qualification: −40°C to 105°C operating range supports deployment in demanding environments.
  • Proven family and vendor support: Member of the PowerQUICC III family from NXP Semiconductors, offering consistency within a known embedded communications product line.

Why Choose MPC8555ECPXALF?

The MPC8555ECPXALF positions itself as a compact, industrial‑rated embedded processor with integrated communications, memory controllers and security features tailored for networking, telecommunications and wireless infrastructure applications. Its combination of a PowerPC e500 core, dual gigabit Ethernet, CPM offload capabilities and on‑chip security makes it suitable for designs that require consolidated system logic and deterministic embedded performance.

Designed and supplied by NXP Semiconductors and belonging to the PowerQUICC III family, the MPC8555ECPXALF delivers a balance of processing capability, interface integration and industrial qualification for systems requiring long‑term robustness and field deployment.

Request a quote or submit a pricing inquiry to evaluate the MPC8555ECPXALF for your next embedded networking or telecommunications design.

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