MPC8555ECPXAJD

IC MPU MPC85XX 533MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 533MHz 783-FCPBGA (29x29)

Quantity 491 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8555
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A002A1 FREEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed533MHz
Supplier Device Package783-FCPBGA (29×29)USBUSB 2.0 (1)Voltage – I/O2.5V, 3.3V

Overview of MPC8555ECPXAJD – IC MPU MPC85XX 533MHZ 783FCPBGA

The MPC8555ECPXAJD is a PowerPC e500 based microprocessor integrating a 32-bit, single-core 533 MHz MPU with system logic targeted for networking, telecommunications, and wireless infrastructure applications. As a member of the MPC8555 PowerQUICC III family from NXP Semiconductors, it combines an embedded processor core with on-chip communications, security and memory subsystems to simplify embedded communications designs.

Qualified for industrial use and supplied in a compact 783-FCPBGA (29×29) surface-mount package, this device is positioned for designers requiring integrated interfaces, security acceleration and rugged operating temperature support.

Key Features

  • Core and Architecture PowerPC e500 Book E–compatible core, single 32-bit core running at 533 MHz with embedded-focused MMU and enhanced hardware/software debug support.
  • Processor Micro-architecture Dual-issue superscalar execution with a 7-stage pipeline, 32 KB L1 instruction cache and 32 KB L1 data cache with parity protection and selectable cache locking.
  • Memory Subsystem On-chip memory controllers supporting DDR and SDRAM, plus features tailored for embedded memory management.
  • Integrated Communications Two three-speed Ethernet controllers (10/100/1000 Mbps) and one USB 2.0 port, together with a Communications Processor Module (CPM) for protocol offload.
  • Security and Cryptography On-chip security co-processor (SEC) with cryptography support and a hardware random number generator for secure embedded applications.
  • Peripheral Interfaces Additional interfaces such as DUART, I2C and PCI support (referenced in device hardware specification) for flexible system connectivity.
  • Power and Debug Features Dynamic power management and performance monitor facilities, plus enhanced debug capabilities documented in the device reference manuals.
  • Package and Environmental 783-ball FCPBGA package (29×29) for surface-mount assembly; industrial operating temperature range from −40 °C to 105 °C. RoHS compliant.

Typical Applications

  • Networking Equipment High-performance embedded processing and integrated Ethernet make this device suitable for routers, switches and other packet-processing equipment.
  • Telecommunications Infrastructure On-chip communications subsystems and CPM support protocol handling for telecom equipment and infrastructure nodes.
  • Wireless Infrastructure Integration of processing, DDR/SDRAM memory controllers and security features supports wireless infrastructure control and management functions.
  • Industrial Embedded Systems Industrial qualification and wide operating temperature range enable use in rugged embedded control and communications applications.

Unique Advantages

  • Highly Integrated Communications Subsystem: Ethernet, USB 2.0 and the CPM are integrated on-chip to reduce external components and simplify board-level design.
  • Embedded Security Acceleration: Dedicated security co-processor and hardware RNG accelerate cryptographic operations and improve secure system design.
  • Deterministic Embedded Core: PowerPC e500 core with lockable L1 caches and an embedded-focused MMU provides predictable performance for real-time communications tasks.
  • Memory Flexibility: DDR and SDRAM controller support and robust L1 caching mechanisms enable efficient data throughput for packet and buffer handling.
  • Industrial Reliability: Surface-mount 783-FCPBGA package and −40 °C to 105 °C operating range support deployment in demanding environments.
  • Design and Debug Support: Enhanced hardware debug facilities, performance monitoring and documented hardware specification ease prototyping and validation.

Why Choose MPC8555ECPXAJD?

The MPC8555ECPXAJD delivers a balanced combination of embedded processing performance, integrated communications and security subsystems, and industrial-grade environmental tolerance. Its PowerPC e500 core and on-chip peripherals reduce system complexity while providing the features needed for networking, telecom and wireless infrastructure designs.

This device is well suited for engineers and development teams building communications-focused embedded systems that require integrated interfaces, hardware security primitives and a compact BGA footprint. Its family heritage and available hardware documentation support system bring-up and long-term deployment in industrial applications.

Request a quote or submit an inquiry to get pricing and availability for the MPC8555ECPXAJD and begin integrating this PowerQUICC III device into your next embedded communications design.

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