MPC8555EPXAQF

IC MPU MPC85XX 1.0GHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29)

Quantity 413 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8555
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A002A1 FREEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSecurity FeaturesCryptography, Random Number GeneratorSpeed1.0GHz
Supplier Device Package783-FCPBGA (29×29)USBUSB 2.0 (1)Voltage – I/O2.5V, 3.3V

Overview of MPC8555EPXAQF – IC MPU MPC85XX 1.0GHZ 783FCPBGA

The MPC8555EPXAQF is a PowerPC e500-based microprocessor designed for embedded communications and networking applications. It integrates a 1.0 GHz, 32-bit PowerPC e500 core with system logic targeted at networking, telecommunications, and wireless infrastructure use cases.

This device delivers a compact, surface-mount 783-FCPBGA (29×29) package, dual gigabit Ethernet interfaces, USB 2.0, security engines and DDR/SDRAM memory controllers—providing a highly integrated solution for embedded communications platforms and consumer networking equipment.

Key Features

  • Core  PowerPC e500 embedded core, 32-bit single core running at 1.0 GHz with features from the e500 Book E architecture including dual-issue execution.
  • Cache and Performance  On-chip architecture includes L1 caches and architectural features described in the MPC8555E series documentation to support embedded application performance and debug.
  • On-chip Co-processors  Communications Processor Module (CPM) and Security (SEC) co-processors for communications and cryptography offload, including a hardware Random Number Generator.
  • Memory Interfaces  Integrated DDR and SDRAM memory controllers to support system memory needs for embedded applications.
  • Networking & Peripherals  Two 10/100/1000 Mbps Ethernet ports, one USB 2.0 port and DUART for serial console/communications.
  • System Interfaces  Support for common peripheral and system interfaces referenced in the device documentation, including Local Bus, PCI, I2C and JTAG.
  • Security  Built-in cryptography capabilities and a random number generator to support secure communications and data protection functions.
  • Package & Mounting  783-ball FCPBGA package (29×29 mm) designed for surface-mount assembly; RoHS compliant.
  • Operating Range  Specified operating temperature range from 0 °C to 105 °C for consumer-qualified designs.

Typical Applications

  • Networking Equipment  Ideal for consumer and embedded networking devices that require integrated Ethernet, USB and communications processing.
  • Telecommunications Systems  Suited to telecom platform designs that benefit from on-chip communications co-processors and high-speed memory interfaces.
  • Wireless Infrastructure  Appropriate for wireless infrastructure modules requiring integrated security engines and deterministic embedded processing.
  • Embedded Communications Platforms  Use in compact embedded systems that need a single-chip solution combining CPU, memory controller and peripheral interfaces.

Unique Advantages

  • Integrated Communications Subsystem: On-chip CPM and dual gigabit Ethernet ports reduce external component count for communications-centric designs.
  • Security-Ready: Hardware cryptography and a random number generator provide foundational security functions without adding external security ICs.
  • Memory Flexibility: Built-in DDR and SDRAM controllers simplify board-level memory design and support a range of system memory configurations.
  • Compact, Surface-Mount Package: 783-FCPBGA (29×29) minimizes board area while supporting high pin-count connectivity for system interfaces.
  • Processor Performance: 1.0 GHz PowerPC e500 core delivers embedded processing capability suitable for networking and communications workloads.
  • Standards-Based Peripheral Support: Includes USB 2.0, DUART and common bus interfaces to ease integration with standard peripherals and subsystems.

Why Choose MPC8555EPXAQF?

The MPC8555EPXAQF combines a PowerPC e500 1.0 GHz core with integrated communications logic, security engines and memory controllers to provide a compact, function-rich platform for embedded networking and telecommunications designs. Its on-chip peripherals and co-processors reduce external BOM and simplify system integration for consumer and embedded communications products.

Backed by NXP Semiconductors documentation for the MPC8555E series, this device is suited to designers who need an integrated processing and communications solution with verified hardware features and standard peripheral support—helping accelerate development and deployment of embedded communications systems.

Request a quote or submit an inquiry to get pricing and availability for the MPC8555EPXAQF and to discuss how it fits your embedded communications design requirements.

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