MPC855TZQ50D4-NXP

The MPC855TZQ50D4-NXP is a single-core, 32-bit microprocessor from NXP Semiconductors’ MPC855 family, operating at 50 MHz. It combines an MPC8xx core architecture with integrated communications support and DRAM controller functionality for embedded designs.

Designed for consumer-grade embedded applications, this device targets systems requiring integrated Ethernet connectivity, communication co-processing, and a compact surface-mount PBGA footprint for space-constrained boards.

Key Features

• Core Single 32-bit MPC8xx core running at 50 MHz, providing deterministic processing for embedded control and communications tasks.
• Communications Co-Processor (CPM) Integrated communications co-processor (CPM) to offload protocol handling and improve overall system throughput.
• Ethernet Interfaces Includes one 10 Mbps Ethernet interface and one 10/100 Mbps Ethernet interface for diverse network connectivity options.
• Memory Support On-chip DRAM controller support for external memory integration, enabling flexible system memory configurations.
• Peripheral Interfaces Additional interfaces include HDLC/SDLC for serial link framing and communications protocol support.
• Power and I/O 3.3 V I/O voltage for compatibility with common embedded peripherals and board-level power domains.
• Package and Mounting 357-pin PBGA supplier device package (25 × 25 mm) in a 357-BBGA case with surface-mount mounting for compact board layouts.
• Operating Range Qualified for consumer applications with an operating temperature range of 0 °C to 95 °C.
• RoHS Compliant Meets RoHS environmental requirements for lead-free assembly and manufacturing.

Typical Applications

• Embedded Communications Equipment — Utilizes the CPM and Ethernet interfaces to manage protocol processing and network connectivity in communication-focused embedded systems.
• Industrial Control Devices — Single-core deterministic processing and DRAM controller support enable control and monitoring functions in consumer-grade industrial applications.
• Networked Consumer Electronics — On-board 10/100 Mbps Ethernet and HDLC/SDLC interfaces facilitate networking and serial communications in connected consumer products.

Unique Advantages

• Integrated Communications Processing: The CPM offloads protocol tasks from the main core, simplifying firmware design and improving effective system performance.
• Dual Ethernet Options: Having both a 10 Mbps and a 10/100 Mbps Ethernet interface provides flexibility for mixed-speed network deployments.
• Compact PBGA Package: The 357-PBGA (25×25 mm) surface-mount package supports high-density board designs while accommodating required I/O.
• Standard 3.3 V I/O: Compatible I/O voltage simplifies interfacing to common peripherals and reduces level-shifting requirements.
• Consumer Qualification & RoHS Compliance: Suited for consumer-grade products with RoHS environmental compliance for lead-free manufacturing.

Why Choose MPC855TZQ50D4-NXP?

The MPC855TZQ50D4-NXP positions itself as a practical, integrated solution for embedded designs that require a single 32-bit core coupled with dedicated communications processing and Ethernet connectivity. Its combination of a 50 MHz MPC8xx core, DRAM controller support, and specialized serial interfaces makes it suitable for compact, network-enabled consumer and embedded systems.

With a compact PBGA package, 3.3 V I/O, consumer qualification, and RoHS compliance from NXP Semiconductors, this device offers a balance of integration and manufacturability for projects that need reliable communications features in a small footprint.

Request a quote or submit your requirements today to receive pricing and availability for the MPC855TZQ50D4-NXP and to discuss how it fits your next embedded design.