MPC8560VT833LC

IC MPU MPC85XX 833MHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29)

Quantity 1,828 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A991B4BEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed833MHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of MPC8560VT833LC – PowerPC e500 833 MHz Microprocessor

The MPC8560VT833LC is a single-core, 32‑bit PowerPC e500 microprocessor operating at 833 MHz and packaged in a 783‑FCPBGA (29×29) surface‑mount package. It integrates a Power Architecture™ core with system logic tailored for networking, telecommunications, and wireless infrastructure applications.

Designed as a member of the PowerQUICC™ III family, the device combines processor performance, on‑chip communications support and memory interface options to simplify embedded communications designs and accelerate time to market.

Key Features

  • Core & Architecture 
    PowerPC e500 32‑bit core at 833 MHz, designed on Power Architecture technology and delivered as a single processing core.
  • L1 Caches & MMU 
    32‑KB instruction cache and 32‑KB data cache with parity protection; caches can be locked. Includes an MMU optimized for embedded applications.
  • Communications Co‑processor (CPM) 
    Integrated CPM for communications tasks; datasheet notes a high‑performance RISC CPM operating up to 333 MHz to offload protocol handling.
  • Memory Interfaces 
    On‑chip support for DDR and SDRAM memory controllers to meet system memory requirements for embedded networking functions.
  • Ethernet 
    Two 10/100/1000 Mbps Ethernet MACs, enabling multi‑port Gigabit connectivity for networking and communications equipment.
  • Peripheral & I/O 
    Includes I2C and additional system interfaces referenced in the device documentation to support board‑level control and management.
  • System Integration 
    PowerQUICC III family system logic integration for networking, telecommunications and wireless infrastructure use cases as described in the device documentation.
  • Package & Mounting 
    783‑FCPBGA (29×29) package, surface mount mounting type suitable for compact embedded boards.
  • Operating Range & Compliance 
    Operational temperature range 0 °C to 105 °C and RoHS compliant; qualification listed as Consumer.

Typical Applications

  • Networking Equipment 
    Multi‑port Ethernet capability and integrated communications logic make the MPC8560VT833LC suitable for switches, routers and network appliances requiring Gigabit links.
  • Telecommunications Infrastructure 
    System‑level integration and communications co‑processor support enable use in telecom equipment and protocol processing tasks.
  • Wireless Infrastructure 
    PowerQUICC III integration and memory interface options support base station and wireless aggregation equipment designs.
  • Embedded Communications Systems 
    Single‑core PowerPC e500 performance with on‑chip peripherals and memory controllers supports compact embedded communications controllers and appliances.

Unique Advantages

  • Highly integrated Power Architecture solution: Combines a PowerPC e500 core with on‑chip system logic from the PowerQUICC III family to reduce external component count.
  • Dual Gigabit Ethernet: Two 10/100/1000 Mbps MACs provide native multi‑port Ethernet capability for demanding networking roles.
  • Embedded memory support: DDR and SDRAM controller support enables flexible memory design choices for performance and capacity.
  • Communications offload with CPM: Integrated CPM operating up to 333 MHz handles communications processing to free the main core for application tasks.
  • Board level readiness: 783‑FCPBGA (29×29) surface‑mount package and documented thermal/clocking/system design information simplify PCB integration.
  • Compliance and temperature range: RoHS compliant with an operating temperature range of 0 °C to 105 °C for typical embedded deployments.

Why Choose MPC8560VT833LC?

The MPC8560VT833LC delivers a focused blend of PowerPC e500 processing performance and integrated communications logic targeted at networking, telecommunications and wireless infrastructure designs. Its combination of on‑chip CPM, dual Gigabit Ethernet MACs and DDR/SDRAM controller support helps simplify system architecture and reduce BOM complexity.

This device is suited for designers needing a compact, RoHS‑compliant embedded processor solution with documented platform features from the PowerQUICC III family and on‑chip resources to accelerate development of communication‑centric applications.

Request a quote or submit an RFQ to obtain pricing, lead time and availability for the MPC8560VT833LC for your project needs.

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