MPC8560VT833LC
| Part Description |
PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 833MHz 783-FCPBGA (29x29) |
|---|---|
| Quantity | 1,828 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8560 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | PowerPC e500 | Device Package | 783-FCPBGA (29x29) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A991B4B | Ethernet | 10/100/1000Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 105°C (TA) | ||
| Package / Case | 783-BFBGA, FCBGA | RAM Controllers | DDR, SDRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 833MHz | Supplier Device Package | 783-FCPBGA (29×29) | ||
| Voltage – I/O | 2.5V, 3.3V |
Overview of MPC8560VT833LC – PowerPC e500 833 MHz Microprocessor
The MPC8560VT833LC is a single-core, 32‑bit PowerPC e500 microprocessor operating at 833 MHz and packaged in a 783‑FCPBGA (29×29) surface‑mount package. It integrates a Power Architecture™ core with system logic tailored for networking, telecommunications, and wireless infrastructure applications.
Designed as a member of the PowerQUICC™ III family, the device combines processor performance, on‑chip communications support and memory interface options to simplify embedded communications designs and accelerate time to market.
Key Features
- Core & Architecture
PowerPC e500 32‑bit core at 833 MHz, designed on Power Architecture technology and delivered as a single processing core. - L1 Caches & MMU
32‑KB instruction cache and 32‑KB data cache with parity protection; caches can be locked. Includes an MMU optimized for embedded applications. - Communications Co‑processor (CPM)
Integrated CPM for communications tasks; datasheet notes a high‑performance RISC CPM operating up to 333 MHz to offload protocol handling. - Memory Interfaces
On‑chip support for DDR and SDRAM memory controllers to meet system memory requirements for embedded networking functions. - Ethernet
Two 10/100/1000 Mbps Ethernet MACs, enabling multi‑port Gigabit connectivity for networking and communications equipment. - Peripheral & I/O
Includes I2C and additional system interfaces referenced in the device documentation to support board‑level control and management. - System Integration
PowerQUICC III family system logic integration for networking, telecommunications and wireless infrastructure use cases as described in the device documentation. - Package & Mounting
783‑FCPBGA (29×29) package, surface mount mounting type suitable for compact embedded boards. - Operating Range & Compliance
Operational temperature range 0 °C to 105 °C and RoHS compliant; qualification listed as Consumer.
Typical Applications
- Networking Equipment
Multi‑port Ethernet capability and integrated communications logic make the MPC8560VT833LC suitable for switches, routers and network appliances requiring Gigabit links. - Telecommunications Infrastructure
System‑level integration and communications co‑processor support enable use in telecom equipment and protocol processing tasks. - Wireless Infrastructure
PowerQUICC III integration and memory interface options support base station and wireless aggregation equipment designs. - Embedded Communications Systems
Single‑core PowerPC e500 performance with on‑chip peripherals and memory controllers supports compact embedded communications controllers and appliances.
Unique Advantages
- Highly integrated Power Architecture solution: Combines a PowerPC e500 core with on‑chip system logic from the PowerQUICC III family to reduce external component count.
- Dual Gigabit Ethernet: Two 10/100/1000 Mbps MACs provide native multi‑port Ethernet capability for demanding networking roles.
- Embedded memory support: DDR and SDRAM controller support enables flexible memory design choices for performance and capacity.
- Communications offload with CPM: Integrated CPM operating up to 333 MHz handles communications processing to free the main core for application tasks.
- Board level readiness: 783‑FCPBGA (29×29) surface‑mount package and documented thermal/clocking/system design information simplify PCB integration.
- Compliance and temperature range: RoHS compliant with an operating temperature range of 0 °C to 105 °C for typical embedded deployments.
Why Choose MPC8560VT833LC?
The MPC8560VT833LC delivers a focused blend of PowerPC e500 processing performance and integrated communications logic targeted at networking, telecommunications and wireless infrastructure designs. Its combination of on‑chip CPM, dual Gigabit Ethernet MACs and DDR/SDRAM controller support helps simplify system architecture and reduce BOM complexity.
This device is suited for designers needing a compact, RoHS‑compliant embedded processor solution with documented platform features from the PowerQUICC III family and on‑chip resources to accelerate development of communication‑centric applications.
Request a quote or submit an RFQ to obtain pricing, lead time and availability for the MPC8560VT833LC for your project needs.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016