MPC8560VTAQFB

IC MPU MPC85XX 1.0GHZ 783FCPBGA
Part Description

PowerPC e500 Microprocessor IC MPC85xx 1 Core, 32-Bit 1.0GHz 783-FCPBGA (29x29)

Quantity 1,001 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMPC8560
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorPowerPC e500Device Package783-FCPBGA (29x29)
ECCN5A991B4BEthernet10/100/1000Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)
Package / Case783-BFBGA, FCBGARAM ControllersDDR, SDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed1.0GHzSupplier Device Package783-FCPBGA (29×29)
Voltage – I/O2.5V, 3.3V

Overview of MPC8560VTAQFB – IC MPU MPC85XX 1.0GHZ 783FCPBGA

The MPC8560VTAQFB is a PowerPC e500 microprocessor IC in the PowerQUICC III family, delivered as a single 32‑bit core running at 1.0 GHz. It combines a high‑performance core with integrated system logic targeted at networking, telecommunications, and wireless infrastructure applications.

Designed for embedded communications systems, the device integrates on‑chip peripherals and controllers to simplify system design while providing robust processor features such as L1 caches and an embedded CPM for communications processing.

Key Features

  • Core  PowerPC e500 32‑bit processor, single core at 1.0 GHz; includes on‑chip MMU and performance monitoring facilities described in the device documentation.
  • Caches and Debug  32‑KB L1 instruction cache and 32‑KB L1 data cache with parity protection; cache locking and embedded debug/performance monitor features are available as documented.
  • Communications Co‑processor (CPM)  Integrated CPM for communications tasks; CPM operates as specified in the product documentation to support protocol and I/O offload.
  • Memory Controllers  On‑chip controllers supporting DDR and SDRAM memory interfaces for flexible system memory design.
  • Ethernet  Dual 10/100/1000 Mbps Ethernet interfaces (2 MACs) for high‑speed network connectivity.
  • Peripheral Interfaces  I2C plus support for industry interfaces documented for this device family, including PCI/PCI‑X and RapidIO controllers where applicable in the product documentation.
  • System and Bus Support  Integrated local bus, DMA controller and JTAG support as detailed in the device documentation to aid system integration and debugging.
  • Package and Thermal  783‑FCPBGA (29×29) surface‑mount package; operating temperature range 0 °C to 105 °C; RoHS compliant.
  • Qualification  Consumer‑level qualification as indicated in the product specifications.

Typical Applications

  • Networking Equipment  Ideal for routers, switches and other network appliances needing integrated MACs and protocol processing.
  • Telecommunications Infrastructure  Suited to gateways, protocol converters and telecom line cards where integrated communications logic and a high‑performance core are required.
  • Wireless Infrastructure  Applicable to base station controllers and wireless backhaul elements that benefit from embedded CPM and high‑speed Ethernet connectivity.
  • Embedded Communications Systems  Useful for systems requiring protocol offload, DMA and local bus interfacing alongside DDR/SDRAM memory support.

Unique Advantages

  • Integrated System Logic: Combines processor core with on‑chip peripherals and controllers to reduce external components and simplify board design.
  • Deterministic On‑Chip Performance: 1.0 GHz PowerPC e500 core with dedicated L1 instruction and data caches for responsive embedded execution.
  • Built for Communications: On‑chip CPM and multiple high‑speed interfaces (dual gigabit Ethernet, DDR/SDRAM controllers) address common requirements in networking and telecom designs.
  • Flexible I/O and Bus Options: Support for local bus, DMA, PCI/PCI‑X and RapidIO (as specified in device documentation) enables integration into a variety of system architectures.
  • Robust Packaging and Temperature Range: 783‑FCPBGA (29×29) surface‑mount package with an operating range of 0 °C to 105 °C and RoHS compliance for standard embedded deployments.

Why Choose MPC8560VTAQFB?

The MPC8560VTAQFB positions itself as a single‑core, communications‑focused processor that brings together a PowerPC e500 core and the system logic expected for embedded networking and telecommunications equipment. Its combination of on‑chip CPM, dual gigabit Ethernet, and DDR/SDRAM memory controllers helps reduce external component count and streamlines system design.

This part is well suited to engineers and procurement teams building embedded communications platforms that require a documented, integrated solution with a defined thermal and package profile. The device is supported by detailed hardware documentation that describes the processor, interfaces and integration considerations for system design.

Request a quote or submit an inquiry to receive pricing, availability and access to technical documentation for the MPC8560VTAQFB.

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