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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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KMC68EN360VR25VL
KMC68EN360VR25VLNXP SemiconductorsIC MPU M683XX 25MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
SCC, SMC, SPI
1,581
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KMC68LC302AF16CT
KMC68LC302AF16CTNXP SemiconductorsIC MPU M683XX 16MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,344
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KMC68LC302AF20CT
KMC68LC302AF20CTNXP SemiconductorsIC MPU M683XX 20MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
240
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KMC68LC302AF25CT
KMC68LC302AF25CTNXP SemiconductorsIC MPU M683XX 25MHZ 100LQFPMicroprocessors100-LQFP (14x14)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-LQFP
Supplier Device Package:
100-LQFP (14×14)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,152
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KMC68MH360AI33L
KMC68MH360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
723
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KMC68MH360CAI25L
KMC68MH360CAI25LNXP SemiconductorsIC MPU M683XX 25MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
42
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KMC7447AHX1167NB
KMC7447AHX1167NBNXP SemiconductorsIC MPU MPC74XX 1.167GHZ 360BGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.167GHZ
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-BCBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
250
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KMC7448HX1267ND
KMC7448HX1267NDNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360BGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Mounting Type:
Surface Mount
875
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KMC7448HX1400ND
KMC7448HX1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
1,333
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KMC7448THX1400ND
KMC7448THX1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V-40°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
941
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KMC7448VS1400NC
KMC7448VS1400NCNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCLGAMicroprocessors360-FCCLGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CLGA, FCCLGA
Supplier Device Package:
360-FCCLGA (25×25)
87
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KMC7448VU1267ND
KMC7448VU1267NDNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 360BGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Mounting Type:
Surface Mount
77
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KMC7448VU1400NC
KMC7448VU1400NCNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
360-CBGA, FCCBGA
Supplier Device Package:
360-FCCBGA (25×25)
1,252
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KMC7448VU1400ND
KMC7448VU1400NDNXP SemiconductorsIC MPU MPC74XX 1.4GHZ 360FCCBGAMicroprocessors360-FCCBGA (25x25)1.5V, 1.8V, 2.5V0°C – 105°C
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.4GHz
Mounting Type:
Surface Mount
775
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KMC7457RX1000NC
KMC7457RX1000NCNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 483FCCBGAMicroprocessors483-FCCBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA, FCCBGA
Supplier Device Package:
483-FCCBGA (29×29)
218
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KMC7457RX1267LC
KMC7457RX1267LCNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 483BGAMicroprocessors483-FCCBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA, FCCBGA
Supplier Device Package:
483-FCCBGA (29×29)
457
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KMC7457VG1000NC
KMC7457VG1000NCNXP SemiconductorsIC MPU MPC74XX 1.0GHZ 483FCCBGAMicroprocessors483-FCCBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA, FCCBGA
Supplier Device Package:
483-FCCBGA (29×29)
593
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KMC7457VG1267LC
KMC7457VG1267LCNXP SemiconductorsIC MPU MPC74XX 1.267GHZ 483BGAMicroprocessors483-FCCBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC G4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.267GHz
Co-Processors/DSP:
Multimedia; SIMD
Graphics Acceleration:
No
Voltage – I/O:
1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
483-BCBGA, FCCBGA
Supplier Device Package:
483-FCCBGA (29×29)
512
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KMPC823VR66B2T
KMPC823VR66B2TNXP SemiconductorsIC MPU MPC8XX 66MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
481
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KMPC823VR81B2T
KMPC823VR81B2TNXP SemiconductorsIC MPU MPC8XX 81MHZ 256BGAMicroprocessors256-PBGA (23x23)N/A0°C ~ 95°C (TA)
Core Processor:
PowerPC
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
81MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD, Video
Ethernet:
10Mbps (1)
USB:
USB 1.x (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Mounting Type:
Surface Mount
Package / Case:
256-BBGA
Supplier Device Package:
256-PBGA (23×23)
Additional Interfaces:
I2C, SMC, SCC, SPI, UART
41
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