 | N/A | 5962-9456501MEA | Analog Devices Inc. | IC TRANSCEIVER 2/2 16CDIP | Drivers, Receivers, Transceivers | 16-CDIP | 5V | -55°C ~ 125°C | Number of Drivers/Receivers: 2/2 Receiver Hysteresis: 300 mV Operating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-CDIP (0.300″”, 7.62mm) Supplier Device Package: 16-CDIP | 209 | |
 | N/A | 5962-9456503MEA | Analog Devices Inc. | IC TRANSCEIVER 2/2 16CDIP | Drivers, Receivers, Transceivers | 16-CDIP | 5V | -55°C ~ 125°C | Number of Drivers/Receivers: 2/2 Receiver Hysteresis: 500 mV Operating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Package / Case: 16-CDIP (0.300″”, 7.62mm) Supplier Device Package: 16-CDIP | 1,403 | |
| N/A | | 5962-9457806NXC | Intel | IC MPU INTEL 120MHZ 296CPGA | Microprocessors | 296-CPGA | N/A | -55°C ~ 125°C (TC) | Core Processor: SE Pentium®Processor Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -55°C ~ 125°C (TC) Mounting Type: Through Hole Package / Case: 296-BFCPGA Supplier Device Package: 296-CPGA | 594 | |
| N/A | | 5962-9583701QXA | Intel | IC MPU 80486DX4 25MHZ 168CPGA | Microprocessors | 168-CPGA (44.45x44.45) | N/A | -55°C ~ 125°C | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: -55°C ~ 125°C Mounting Type: Through Hole Supplier Device Package: 168-CPGA (44.45×44.45) | 874 | |
| N/A | | 5962-9583705NXA | Intel | IC MPU INTEL486DX 100MHZ 168CPGA | Microprocessors | 168-CPGA | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 168-CPGA Additional Interfaces: EBI/EMI | 470 | |
| N/A | | 5962-9957201NNA | Advanced Micro Devices | IC FPGA 260 I/O 352MBGA | FPGAs | 352-MBGA (35x35) | 2.375 V - 2.625 V | -55°C – 125°C | Number of Logic Elements/Cells: 6912 | 50 | |
| N/A | | 5962-9957201NUA | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 6912 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 356 | |
| N/A | | 5962-9957301NUA | Advanced Micro Devices | IC FPGA 316 I/O 432MBGA | FPGAs | 432-MBGA (40x40) | 2.375V ~ 2.625V | -55°C ~ 125°C (TJ) | Number of Logic Elements/Cells: 15552 Voltage – Supply: 2.375V ~ 2.625V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 432-LBGA Exposed Pad, Metal Supplier Device Package: 432-MBGA (40×40) | 285 | |
 | | 5962-9957401QXA | Advanced Micro Devices | IC FPGA 404 I/O 28CDIP | FPGAs | 28-CDIP | 2.375 V - 2.625 V | -55°C – 125°C | Number of Logic Elements/Cells: 27648 | 819 | |
| N/A | | 5962-9958501QXC | Microchip Technology | IC FPGA 202 I/O 256CQFP | FPGAs | 256-CQFP (75x75) | 3 V - 5.5 V | -55°C – 125°C | Number of Logic Elements/Cells: 1184 | 1,970 | |
| N/A | | 5962-9958501QYC | Microchip Technology | IC FPGA 176 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 3V ~ 3.6V, 4.5V ~ 5.5V | -55°C ~ 125°C (TJ) | Voltage – Supply: 3V ~ 3.6V, 4.5V ~ 5.5V Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C (TJ) Package / Case: 208-BFCQFP with Tie Bar Supplier Device Package: 208-CQFP (75×75) | 1,385 | |
| N/A | | 5962-9958502QXC | Microchip Technology | IC FPGA 202 I/O 256CQFP | FPGAs | 256-CQFP (75x75) | 3 V - 5.5 V | -55°C – 125°C | Number of Logic Elements/Cells: 1184 | 378 | |
| N/A | | 5962-9958502QYC | Microchip Technology | IC FPGA 176 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 3 V - 5.5 V | -55°C – 125°C | Number of Logic Elements/Cells: 1184 | 934 | |
| N/A | | 5962-9958601QYC | Microchip Technology | IC FPGA 174 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 3 V - 5.5 V | -55°C – 125°C | Number of Logic Elements/Cells: 2880 | 590 | |
| N/A | | 5962-9958602QYC | Microchip Technology | IC FPGA 174 I/O 208CQFP | FPGAs | 208-CQFP (75x75) | 3 V - 5.5 V | -55°C – 125°C | Number of Logic Elements/Cells: 2880 | 295 | |
 | | 5AGTFC7H3F35I3G | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Exposed Pad Supplier Device Package: 1152-FBGA (35×35) | 1,229 | |
 | | 5AGTFC7H3F35I3N | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA (35x35) | 1.12 V - 1.18 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 400 | |
 | N/A | 5AGTFC7H3F35I3NAA | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.12 V - 1.18 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 1,175 | |
 | N/A | 5AGTFC7H3F35I3NAC | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.12V ~ 1.18V | -40°C ~ 100°C (TJ) | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 Voltage – Supply: 1.12V ~ 1.18V Mounting Type: Surface Mount Operating Temperature: -40°C ~ 100°C (TJ) Package / Case: 1152-BBGA, FCBGA Supplier Device Package: 1152-FBGA, FC (35×35) | 402 | |
 | N/A | 5AGTFC7H3F35I3NAD | Intel | IC FPGA 544 I/O 1152FBGA | FPGAs | 1152-FBGA, FC (35x35) | 1.12 V - 1.18 V | -40°C – 100°C | Number of LABs/CLBs: 11460 Number of Logic Elements/Cells: 242000 | 575 | |