5962-9958502QYC
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 176 2560 208-BFCQFP with Tie Bar |
|---|---|
| Quantity | 934 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 60 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFCQFP with Tie Bar | Number of I/O | 176 | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2438 | Number of Logic Elements/Cells | 1184 | ||
| Number of Gates | 54000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2560 |
Overview of 5962-9958502QYC – MX Field Programmable Gate Array (FPGA) IC, 176 I/O, 208‑BFCQFP
The 5962-9958502QYC is a military-grade MX Field Programmable Gate Array (FPGA) IC from Microchip Technology. It combines significant logic capacity, on-chip RAM, and a high I/O count in a 208‑BFCQFP with tie bar package designed for surface-mount assembly.
Engineered for designs that require robust operating range and flexible power rails, this device targets military and rugged embedded applications where temperature tolerance, logic density and interface capability are primary concerns.
Key Features
- Core Architecture MX family FPGA architecture provided by Microchip Technology, offering a programmable fabric suitable for custom logic implementations.
- Logic Capacity Provides 54,000 gates and 1,184 logic elements, enabling the implementation of complex logic functions and moderate-scale digital designs.
- On‑chip Memory Includes 2,560 total RAM bits to support buffering, state storage, and small data structures within the programmable fabric.
- I/O and Package 176 user I/O pins in a 208‑BFCQFP with tie bar package (supplier device package: 208‑CQFP, 75×75) to support dense peripheral and bus interfacing in surface-mount assemblies.
- Power Flexible supply range from 3 V to 5.5 V to accommodate different system power architectures.
- Thermal and Grade Military-grade device rated for operation from −55°C to 125°C, suitable for temperature-demanding deployments.
- Mounting and Compliance Surface-mount package construction and RoHS compliance for standard PCB assembly and environmental requirements.
Typical Applications
- Military and Defense Systems Use in control, processing, and custom I/O functions where military-grade temperature performance and logic capacity are required.
- Avionics and Rugged Embedded Electronics Integration into embedded platforms that demand wide operating temperature limits and a high-density I/O footprint.
- Custom Interface and Signal Processing Implement protocol bridging, custom timing logic, or signal routing leveraging the device’s logic elements and ample I/O.
Unique Advantages
- Military‑grade temperature tolerance: Rated from −55°C to 125°C to support harsh-environment operation.
- High logic and gate count: 1,184 logic elements and 54,000 gates provide capacity for sophisticated custom logic implementations.
- Ample I/O density: 176 I/O pins in a compact 208‑BFCQFP package simplify integration of multiple peripherals and buses.
- Flexible power supply: Operates across 3 V to 5.5 V rails to match a variety of system power designs.
- Compact surface-mount package with tie bar: 208‑BFCQFP format supports standard PCB assembly and handling processes.
- RoHS compliant: Meets environmental material requirements for modern assemblies.
Why Choose 5962-9958502QYC?
5962-9958502QYC positions itself as a robust, military-grade FPGA option with a balance of logic capacity, on-chip RAM, and high I/O count in a standard surface-mount package. Its wide supply voltage range and −55°C to 125°C operating window make it suitable for demanding embedded and defense applications where environmental resilience and design flexibility are essential.
Backed by Microchip Technology, this FPGA is appropriate for engineers designing rugged systems requiring programmable logic, substantial interfacing capability, and compliance with RoHS material standards.
Request a quote or submit a parts inquiry to obtain pricing, availability, and ordering information for 5962-9958502QYC.

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