5962-9958501QYC
| Part Description |
MX Field Programmable Gate Array (FPGA) IC 176 2560 208-BFCQFP with Tie Bar |
|---|---|
| Quantity | 1,140 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 60 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 208-CQFP (75x75) | Grade | Military | Operating Temperature | -55°C – 125°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFCQFP with Tie Bar | Number of I/O | 176 | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2438 | Number of Logic Elements/Cells | 1184 | ||
| Number of Gates | 54000 | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2560 |
Overview of 5962-9958501QYC – MX Field Programmable Gate Array (FPGA) IC 176 2560 208-BFCQFP with Tie Bar
The 5962-9958501QYC is a military-grade MX Field Programmable Gate Array (FPGA) from Microchip Technology, supplied in a 208-BFCQFP package with tie bar for surface-mount assembly. It provides a balanced set of programmable logic, on-chip memory, and I/O resources suited for designs that require rugged operating temperature and flexible supply voltage.
Typical use cases include defense and aerospace applications, embedded control and signal processing, and mixed-voltage systems where a robust operating range and high I/O count are required. The device’s combination of CLBs, logic element cells, RAM, and wide voltage and temperature ranges supports reliable integration into demanding systems.
Key Features
- Core & Logic Provides 2,438 CLBs and 1,184 logic element cells, enabling implementation of custom logic functions and moderate-density FPGA designs.
- Memory Includes 2,560 total RAM bits for on-chip data storage and buffering within logic implementations.
- I/O 176 I/O pins support extensive external interfacing and parallel connections to peripherals and subsystems.
- Gate Count Approximately 54,000 gates for mapping a variety of digital functions and state machines.
- Power Operates from a broad supply range of 3 V to 5.5 V, accommodating common logic domains and mixed-voltage environments.
- Package & Mounting Supplied in a 208-BFCQFP package with tie bar (supplier package: 208-CQFP, 75×75 mm), designed for surface-mount assembly and mechanical stability.
- Temperature & Grade Military-grade device rated for operation from −55 °C to 125 °C, suitable for temperature-critical and rugged applications.
- Compliance RoHS compliant, meeting common materials and environmental requirements.
Typical Applications
- Avionics and Defense Systems Military-grade temperature range and supply flexibility make the device suitable for embedded control, signal processing, and custom logic in defense platforms.
- Embedded Control High I/O count and programmable logic density support motor control, sensor interfacing, and deterministic control tasks.
- Communications and Data Handling On-chip RAM and substantial gate count enable protocol handling, buffering, and custom data-path implementations.
- Mixed-Voltage Systems Wide supply range (3 V to 5.5 V) helps integrate the FPGA into systems with different logic domains without extensive level-shifting hardware.
Unique Advantages
- Military-Grade Thermal Performance: Rated from −55 °C to 125 °C to support applications that operate in wide and harsh temperature extremes.
- Flexible Voltage Range: 3 V to 5.5 V supply support allows deployment across common logic families and reduces the need for additional power domain components.
- High I/O Capacity: 176 I/O pins provide direct connectivity to sensors, actuators, memory, and peripheral devices, simplifying board design.
- Balanced Logic and Memory: 2,438 CLBs, 1,184 logic element cells, and 2,560 RAM bits offer a practical mix for implementing control logic, state machines, and small data buffers.
- Robust Packaging: 208-BFCQFP with tie bar (208-CQFP supplier package) supports surface-mount assembly with mechanical stability for demanding environments.
- RoHS Compliant: Meets materials compliance expectations for modern electronic assemblies.
Why Choose 5962-9958501QYC?
The 5962-9958501QYC positions itself as a reliable, mid-density FPGA option for engineers designing systems that require military-grade temperature performance, a wide supply voltage window, and substantial I/O capability. Its mix of CLBs, logic elements, on-chip RAM, and gate count provides the flexibility to implement custom digital functions without excessive external logic.
This part is ideal for customers in defense, avionics, and other high-reliability markets seeking a field-programmable solution that integrates moderate logic density and memory with a package suitable for surface-mount assembly. The RoHS compliance and industry-standard packaging help support long-term production and assembly workflows.
Request a quote or contact sales to discuss availability, pricing, and how 5962-9958501QYC can fit into your next high-reliability design.

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