5AGTFC7H3F35I3NAD

The 5AGTFC7H3F35I3NAD is an Intel Arria V GT field programmable gate array (FPGA) in a 1152-BBGA (FCBGA) package. It offers high logic density and substantial on-chip RAM with a large number of user I/Os, delivered in an industrial-grade, surface-mount form factor.

This device is designed for industrial applications that require programmable logic, significant memory resources, and broad I/O connectivity while operating across a wide temperature range and a tightly specified core supply voltage.

Key Features

• Core / Logic  Approximately 242,000 logic elements provide the programmable fabric needed for complex digital designs.
• On-chip Memory  15,470,592 total RAM bits of embedded memory to support buffering, large state machines, and data processing functions.
• I/O Capacity  544 user I/O pins for extensive external interfacing and bus/multiplexing requirements.
• Power  Specified core voltage supply range of 1.12 V to 1.18 V for predictable power planning and regulator selection.
• Package & Mounting  1152-BBGA (FCBGA) surface-mount package; supplier package listed as 1152-FBGA, FC (35×35) for PCB footprint considerations.
• Thermal & Grade  Industrial-grade qualification with an operating temperature range of −40 °C to 100 °C for use in demanding environments.
• Environmental Compliance  RoHS-compliant to meet common environmental requirements.

Typical Applications

• Industrial Control & Automation  Implement custom control logic, protocol translation, and I/O aggregation within industrial temperature specifications.
• Embedded Systems & Prototyping  Provide programmable logic and substantial on-chip RAM for system development, proof-of-concept designs, and embedded processing tasks.
• I/O-Intensive Interfaces  Support designs that require large numbers of external connections, data routing, and signal conditioning using 544 I/O pins.

Unique Advantages

• High Logic Density: 242,000 logic elements enable implementation of complex state machines, datapaths, and custom accelerators on a single device.
• Substantial On-Chip RAM: 15,470,592 total RAM bits reduce dependence on external memory for many buffering and lookup-table needs.
• Extensive I/O Count: 544 I/O pins simplify board-level integration and limit the need for additional I/O expanders.
• Industrial Temperature Range: Rated from −40 °C to 100 °C for deployment in temperature-variable industrial environments.
• Compact BGA Footprint: 1152-BBGA (35×35) surface-mount package optimizes board area while supporting high pin count.
• RoHS Compliant: Meets standard environmental compliance for lead-free designs.

Why Choose 5AGTFC7H3F35I3NAD?

The 5AGTFC7H3F35I3NAD combines a high number of logic elements, significant on-chip RAM, and wide I/O capacity in an industrial-grade, surface-mount BGA package from Intel. Its specified core voltage range and operating temperature window make it suitable for engineers who need predictable electrical and thermal behavior in demanding applications.

This FPGA is appropriate for teams building complex, programmable systems that require integrated memory and dense I/O in a compact package, and for projects where industrial temperature performance and RoHS compliance are required.

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