5AGTFD3H3F35I3G

The 5AGTFD3H3F35I3G is an Intel Arria V GT series FPGA in a 1152‑pin ball grid array (FCBGA) package. It delivers high logic density and on‑chip RAM while supporting a large number of I/O, making it suitable for industrial FPGA-based designs that require robust operation over an extended temperature range.

Key architectural attributes include 362,000 logic elements, 19,822,592 total RAM bits and 544 I/O pins. The device is specified for industrial use with an operating temperature range of −40 °C to 100 °C and a core supply range of 1.12 V to 1.18 V.

Key Features

• High Logic Density — 362,000 logic elements to implement complex control, signal processing, or custom logic architectures.
• On‑chip Memory — 19,822,592 total RAM bits provide substantial on‑device storage for buffering, state machines, and local data processing.
• Significant I/O Count — 544 I/O pins support wide parallel interfaces and extensive peripheral connectivity.
• Logic Array Blocks — 17,110 logic array blocks to structure and partition large designs efficiently.
• Package & Mounting — 1152‑BBGA (FCBGA) in a 35 × 35 mm supplier package; surface‑mount mounting for standard PCB assembly.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation to meet demanding environmental requirements.
• Core Power Range — Core voltage supply specified between 1.12 V and 1.18 V for predictable power planning.
• RoHS Compliant — Conforms to RoHS directives for environmental compliance.

Typical Applications

• Industrial Control and Automation — Extended temperature rating and high I/O count make this device suitable for factory automation, motion control, and process control systems.
• High‑Density Logic Implementations — Large logic element and on‑chip RAM capacity support complex state machines, protocol offloads, and custom processing pipelines.
• Interface Aggregation and Peripheral Bridging — 544 I/O pins enable consolidation of multiple parallel and serial interfaces on a single programmable device.

Unique Advantages

• Substantial On‑Device Resources: Combines 362,000 logic elements with nearly 20 million RAM bits to reduce external memory needs and simplify board design.
• High I/O Density: 544 I/Os accommodate complex pinouts and multi‑lane interfaces without requiring multiple FPGAs.
• Industrial Reliability: Specified operation from −40 °C to 100 °C for dependable performance in harsh environments.
• Compact FCBGA Packaging: 1152‑ball FCBGA (35 × 35 mm) balances high pin count with a compact footprint for dense PCB layouts.
• Predictable Power Envelope: Narrow core voltage range (1.12 V–1.18 V) simplifies power‑supply design and thermal planning.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product development.

Why Choose 5AGTFD3H3F35I3G?

The 5AGTFD3H3F35I3G Arria V GT FPGA combines high logic and memory capacity with a large I/O footprint and industrial temperature capability, making it an effective choice for demanding embedded and industrial designs. Its FCBGA package and surface‑mount form factor support compact, high‑density PCB implementations while maintaining the resource counts needed for complex system functions.

This device is appropriate for engineers and teams building solutions that require significant on‑chip resources, extensive peripheral connectivity, and operation across a wide temperature range. Its specifications enable scalable designs that can consolidate functionality and reduce external component count.

Request a quote or submit your pricing inquiry to evaluate 5AGTFD3H3F35I3G for your next design.