5AGTFD3H3F35I5N
| Part Description |
Arria V GT Field Programmable Gate Array (FPGA) IC 544 19822592 362000 1152-BBGA, FCBGA Exposed Pad |
|---|---|
| Quantity | 230 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1152-FBGA (35x35) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1152-BBGA, FCBGA Exposed Pad | Number of I/O | 544 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 17110 | Number of Logic Elements/Cells | 362000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 19822592 |
Overview of 5AGTFD3H3F35I5N – Arria V GT FPGA, 544 I/O, 362,000 Logic Elements, 1152-FBGA
The 5AGTFD3H3F35I5N is an Arria V GT Field Programmable Gate Array (FPGA) offered in an industrial grade package. It provides a large programmable fabric, substantial on-chip RAM, and a high I/O count for designs that require dense logic, memory resources, and broad interface connectivity within a compact surface-mount BGA footprint.
This device is targeted at applications that need configurable hardware resources with controlled core-voltage operation and extended operating temperature support, enabling deployment in industrial environments.
Key Features
- Programmable Fabric — 362,000 logic elements to implement complex digital logic, accelerators, and custom processing pipelines.
- Embedded Memory — 19,822,592 total RAM bits for on-chip storage of buffers, FIFOs, and state information.
- I/O Density — 544 user I/Os to support multiple parallel interfaces, wide buses, and mixed-signal front ends.
- Package and Mounting — 1152-BBGA exposed pad (supplier package: 1152-FBGA, 35×35) in a surface-mount form factor suitable for compact PCB designs.
- Core Voltage — Defined operating supply range of 1.07 V to 1.13 V for predictable power delivery and board-level voltage planning.
- Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for reliable operation in harsh or extended-temperature applications.
- RoHS Compliant — Meets regulatory requirements for lead-free manufacturing processes.
Typical Applications
- Industrial Control and Automation — Implements real-time control logic, protocol handling, and I/O aggregation across a wide temperature range.
- Embedded Processing and Acceleration — Hosts custom hardware accelerators and parallel datapaths using the large logic fabric and on-chip RAM.
- High-Density I/O Systems — Connects to numerous sensors, actuators, or peripheral buses where broad I/O count is required.
- Communication and Protocol Bridging — Integrates multiple interfaces and data-path logic for protocol conversion and interface aggregation.
Unique Advantages
- Large Programmable Resource — 362,000 logic elements enable implementation of substantial custom logic without immediate need for external ASICs or discrete logic.
- Significant On-Chip Memory — Nearly 20 million bits of RAM reduce dependence on external memory for many buffering and storage tasks, simplifying board-level design.
- Wide I/O Capability — 544 I/Os allow for flexible interfacing to multiple subsystems and parallel data lanes, minimizing the need for additional interface chips.
- Industrial Reliability — Rated for −40 °C to 100 °C operation, suitable for deployed systems that experience temperature extremes.
- Compact BGA Package — 1152-FBGA (35×35) package provides high pin count in a manageable board footprint for space-constrained designs.
- Controlled Core Supply — Narrow core voltage window (1.07 V–1.13 V) eases power-supply design and ensures consistent device behavior.
Why Choose 5AGTFD3H3F35I5N?
The 5AGTFD3H3F35I5N Arria V GT FPGA combines a large logic fabric, extensive embedded RAM, and a high I/O count in an industrial-grade, surface-mount BGA package. Its defined core-voltage range and extended operating temperature make it suitable for embedded systems and industrial deployments that require configurable hardware resources.
This part is appropriate for engineering teams needing scalable programmable logic with substantial on-chip memory and broad interface capability, while maintaining compact board-level integration and compliance with RoHS requirements.
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