 | | LQSW6391MELB40 | Nichicon | CAP ALUM 390UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 4.2 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 2.302 A @ 50 kHz Ripple Current Low Frequency: 1.61 A @ 120 Hz Size / Dimension: 40 x 30 mm Surface Mount Land Size: N/A | 1,315 | |
 | | LQSW6391MELC35 | Nichicon | CAP ALUM 390UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 3.7 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 2.302 A @ 50 kHz Ripple Current Low Frequency: 1.61 A @ 120 Hz Size / Dimension: 35 x 35 mm Surface Mount Land Size: N/A | 1,038 | |
 | | LQSW6471MELB45 | Nichicon | CAP ALUM 470UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 4.7 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 2.66 A @ 50 kHz Ripple Current Low Frequency: 1.86 A @ 120 Hz Size / Dimension: 45 x 30 mm Surface Mount Land Size: N/A | 1,216 | |
 | | LQSW6471MELC40 | Nichicon | CAP ALUM 470UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 4.2 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 2.66 A @ 50 kHz Ripple Current Low Frequency: 1.86 A @ 120 Hz Size / Dimension: 40 x 35 mm Surface Mount Land Size: N/A | 1,746 | |
 | | LQSW6561MELC45 | Nichicon | CAP ALUM 560UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 4.7 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 3.003 A @ 50 kHz Ripple Current Low Frequency: 2.1 A @ 120 Hz Size / Dimension: 45 x 35 mm Surface Mount Land Size: N/A | 952 | |
 | | LQSW6681MELC50 | Nichicon | CAP ALUM 680UF ±20% 420V SNAP-IN | Aluminum Electrolytic Capacitors | N/A | 420 V | -25°C - 105°C | Applications: General Purpose Height Seated (Max): 5.2 cm Lifetime @ Temp: 3000 h @ 105°C Ripple Current High Frequency: 3.146 A @ 50 kHz Ripple Current Low Frequency: 2.2 A @ 120 Hz Size / Dimension: 50 x 35 mm Surface Mount Land Size: N/A | 834 | |
 | | LS1012ASE7EKA | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 668 | |
 | | LS1012ASE7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,044 | |
 | | LS1012ASE7HKA | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,223 | |
| N/A | N/A | LS1012ASE7HKB | NXP Semiconductors | IC MPU QORLQ LS1 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 967 | |
 | | LS1012ASE7KKB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 871 | |
 | N/A | LS1012ASN7EKA | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 487 | |
 | | LS1012ASN7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 700 | |
 | | LS1012ASN7HKA | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 923 | |
 | | LS1012ASN7HKB | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 503 | |
 | | LS1012ASN7KKB | NXP Semiconductors | IC MPU QORIQ 1.0GHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | 0°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: 0°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 339 | |
| N/A | N/A | LS1012AXE7EKA | NXP Semiconductors | IC MPU QORLQ LS1 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 907 | |
 | | LS1012AXE7EKB | NXP Semiconductors | IC MPU QORIQ 600MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,468 | |
 | | LS1012AXE7HKA | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 1,825 | |
 | | LS1012AXE7HKB | NXP Semiconductors | IC MPU QORIQ 800MHZ 211FCLGA | Microprocessors | 211-FCLGA (9.6x9.6) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 1 Core, 64-Bit USB: USB 2.0 (1), USB 3.0 + PHY Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 211-FCLGA (9.6×9.6) | 613 | |