LS1012ASN7HKB

IC MPU QORIQ 800MHZ 211FCLGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 1 Core, 64-Bit 800MHz 211-FCLGA (9.6x9.6)

Quantity 166 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1012A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package211-FCLGA (9.6x9.6)ECCN3A991A2
EthernetGbE (2)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit
Operating Temperature0°C ~ 105°CPackage / Case211-VFLGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed800MHzSupplier Device Package211-FCLGA (9.6×9.6)
USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1012ASN7HKB – IC MPU QORIQ 800MHZ 211FCLGA

The LS1012ASN7HKB is a single‑core, 64‑bit microprocessor in NXP's QorIQ Layerscape LS1012A family, integrating an ARM® Cortex®‑A53 core at 800 MHz in a compact 211‑FCLGA (9.6 × 9.6 mm) package. It targets small form‑factor, fanless networking and IoT applications where low power, integrated networking and hardware security are required.

Designed for connectivity‑centric designs, the device pairs DDR3L memory support with multi‑protocol SerDes, Ethernet, SATA and USB interfaces, alongside hardware packet acceleration and trust features to simplify system design and improve throughput and security.

Key Features

  • Core  ARM® Cortex®‑A53 single 64‑bit core running at 800 MHz for application processing; includes NEON SIMD and dual‑precision FPU plus ECC‑protected caches (32 KB L1 instruction/data, 256 KB coherent L2).
  • Memory  DDR3L memory controller support; memory subsystem supports 16‑bit DDR3L devices at up to 1 GHz.
  • Networking and SerDes  Three‑lane, 6 GHz multi‑protocol SerDes providing interfaces for high‑speed peripherals; integrated support for up to two Gigabit Ethernet ports and DMA‑controlled PCI Express® Gen2.
  • Storage and USB  Integrated SATA 3.0 (6 Gbps) port and dual USB controllers—one SuperSpeed USB 3.0 with integrated PHY and one USB 2.0 controller; additional support for QuadSPI and SD/MMC.
  • Packet Acceleration  On‑chip hardware packet forwarding engine (PFE) to offload IP packet processing, enabling high throughput with minimal CPU load (PFE capable of 2 Gbit/s IP forwarding as documented in the product family data).
  • Security  Hardware security features including Secure Boot and Arm TrustZone® to help protect boot and runtime integrity; hardware accelerators for packet processing and security functions are included.
  • Power and Efficiency  Designed for low‑power operation with a typical power figure of 1 W for the Layerscape LS1012A family, suitable for fanless and battery‑sensitive designs.
  • Package and Thermal  211‑FCLGA (9.6 × 9.6 mm) surface‑mount package; operating temperature range 0 °C to 105 °C.

Typical Applications

  • Trust‑enabled IoT gateways  Secure connectivity and hardware trust features enable gateways that require validated boot and runtime security.
  • Consumer and mobile NAS  Integrated SATA 6 Gbps and hardware packet acceleration make the device suitable for consumer NAS and battery‑powered mobile NAS solutions.
  • Entry‑level broadband Ethernet gateways  Dual GbE ports, packet forwarding offload and low power consumption suit entry‑level gateway and home router designs.
  • Building and factory automation  Compact package, robust interfaces and security support enable deployment in automation controllers and edge devices.
  • Ethernet drives and storage appliances  SATA and PCIe connectivity combined with packet acceleration support data‑centric storage applications.

Unique Advantages

  • Highly integrated communications engine: Single‑chip integration of CPU, Ethernet, SATA, USB and SerDes reduces BOM and board area for compact designs.
  • Hardware packet offload: On‑chip PFE yields high IP forwarding throughput with minimal CPU utilization, simplifying software requirements and lowering power.
  • Built‑in security architecture: Secure Boot and TrustZone® provide foundation security features for protected boot and trusted execution environments.
  • Low power, small form factor: Typical 1 W power profile in a 9.6 × 9.6 mm package enables fanless and compact system implementations.
  • Broad I/O mix: Native support for GbE, SATA 3.0, USB 3.0/2.0, PCIe Gen2, QuadSPI and SD/MMC covers common connectivity and storage needs without external bridges.
  • Development enablement and longevity: The Layerscape family is supported by evaluation boards, software BSPs and third‑party ecosystems, and is included in NXP’s product longevity program to support stable supply.

Why Choose LS1012ASN7HKB?

The LS1012ASN7HKB combines a 64‑bit ARM® Cortex®‑A53 core with targeted networking and security features in a compact, low‑power package, making it well suited for designers building fanless gateways, NAS devices, storage appliances and industrial edge systems. Its mix of integrated interfaces and packet/security accelerators simplifies system architecture while preserving performance.

Supported by platform-level enablement and a broad ecosystem, this processor offers a practical balance of performance, integration and long‑term availability for embedded communications and IoT designs that require secure, efficient packet processing in a small footprint.

Request a quote or submit an inquiry to evaluate LS1012ASN7HKB for your next embedded networking or storage design.

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