LS1012AXE7HKB

IC MPU QORIQ 800MHZ 211FCLGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 1 Core, 64-Bit 800MHz 211-FCLGA (9.6x9.6)

Quantity 331 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1012A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package211-FCLGA (9.6x9.6)ECCN5A002A1 FRE
EthernetGbE (2)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case211-VFLGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed800MHzSupplier Device Package211-FCLGA (9.6×9.6)
USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1012AXE7HKB – IC MPU QORIQ 800MHZ 211FCLGA

The LS1012AXE7HKB is a single-core, 64-bit microprocessor from NXP's QorIQ Layerscape LS1012A family featuring an ARM® Cortex®-A53 core running at 800 MHz. It combines compact packaging and low typical power with integrated networking, storage and security features targeted at embedded networking and IoT edge applications.

Designed for fanless, small form-factor products, the device addresses use cases such as trust-enabled IoT gateways, consumer and mobile NAS, entry-level broadband Ethernet gateways, Ethernet storage drives and building or factory automation where integration, low power and industrial temperature operation are important.

Key Features

  • Core  Single ARM® Cortex®-A53 64-bit core operating at 800 MHz with NEON SIMD and dual-precision FPU, plus ECC-protected L1 and L2 caches (32 KB L1 I/D, 256 KB coherent L2).
  • Memory  Integrated memory controller supporting 16-bit DDR3L devices; system-level support for DDR3L as specified in the product data.
  • Networking & SerDes  Three-lane multi-protocol SerDes (6 GHz) enabling support for up to two Gigabit Ethernet ports and additional high-speed interfaces.
  • Storage & USB  On-chip support for one SATA 6 Gbps port and dual USB controllers—one SuperSpeed USB 3.0 with integrated PHY and one USB 2.0 controller.
  • Packet Processing & Acceleration  Includes a hardware packet forwarding engine (PFE) to offload IP packet processing and increase forwarding throughput with reduced CPU load; hardware accelerators for packet and security processing are integrated.
  • Security  Secure Boot and ARM TrustZone® support provide trust-enabled boot and runtime security functionality.
  • Power & Efficiency  Described in product materials as a low-power communications microprocessor with a typical power target around 1 W for efficient fanless operation.
  • Package & Mounting  211-FCLGA supplier device package (9.6 × 9.6 mm), 211-VFLGA package case option; surface-mount package suitable for compact designs.
  • Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Trust-enabled IoT Gateways  Secure edge processing and packet offload support for gateway devices requiring trusted boot and runtime isolation.
  • Consumer and Mobile NAS  Compact, low-power storage controllers for home or battery-powered mobile NAS appliances using SATA and network interfaces.
  • Entry-level Broadband Ethernet Gateways  Integrated GbE ports and packet forwarding acceleration for small broadband gateway and router platforms.
  • Ethernet Drives and Data Storage  Support for SATA 6 Gbps and networking for Ethernet-connected storage and drive enclosures.
  • Building and Factory Automation  Industrial-temperature operation and integrated interfaces for embedded automation controllers and edge devices.

Unique Advantages

  • Highly integrated networking subsystem: On-chip SerDes, dual GbE support and a hardware packet forwarding engine reduce external PHY and processor load, simplifying BOM and system design.
  • Storage and I/O consolidation: Native SATA 6 Gbps plus USB 3.0 (with PHY) and USB 2.0 consolidate storage and peripheral interfaces in a single device.
  • Security-ready platform: Secure Boot and TrustZone® support enable trust-enabled applications and secure firmware boot sequences.
  • Compact, low-power footprint: Small 9.6 × 9.6 mm package and typical 1 W power targeting make the device suitable for fanless, space-constrained designs.
  • Industrial temperature capability: −40 °C to 105 °C operating range supports deployment in harsh and industrial environments.
  • Long-term ecosystem support: The Layerscape family ecosystem and product longevity support help preserve development investment and simplify migration within the platform.

Why Choose LS1012AXE7HKB?

The LS1012AXE7HKB positions itself as a compact, low-power single-core 64-bit processor that integrates networking, storage and security features suited to embedded communications and IoT edge products. Its combination of DDR3L memory support, dual GbE, SATA 6 Gbps, USB 3.0 with PHY, and hardware packet-forwarding acceleration provides a balanced foundation for space- and power-constrained designs.

Ideal for engineers building fanless gateways, small NAS devices, entry-level routers and industrial controllers, the LS1012AXE7HKB offers industrial temperature qualification and ecosystem support to help reduce time-to-market and preserve long-term supply and software enablement.

Request a quote or submit an inquiry to evaluate the LS1012AXE7HKB for your next embedded networking or IoT project.

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