LS1012AXN7EKA

IC MPU QORIQ 600MHZ 211FCLGA
Part Description

ARM® Cortex®-A53 Microprocessor IC QorIQ® Layerscape 1 Core, 64-Bit 600MHz 211-FCLGA (9.6x9.6)

Quantity 116 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1012A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time39 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A53Device Package211-FCLGA (9.6x9.6)ECCN3A991A2
EthernetGbE (2)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case211-VFLGARAM ControllersDDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed600MHzSupplier Device Package211-FCLGA (9.6×9.6)
USBUSB 2.0 (1), USB 3.0 + PHY

Overview of LS1012AXN7EKA – IC MPU QORIQ 600MHZ 211FCLGA

The LS1012AXN7EKA is an NXP QorIQ Layerscape microprocessor featuring a single 64‑bit ARM® Cortex®‑A53 core at 600 MHz in a compact 211‑FCLGA (9.6 × 9.6 mm) package. It targets fanless, small form factor embedded and networking applications where integration, industrial temperature range, and power-efficient packet processing are required.

Designed for connected storage, gateway and automation designs, this device combines a DDR3L memory controller, multi‑protocol SerDes I/O and integrated networking interfaces with hardware security features to simplify system design and support industrial deployments.

Key Features

  • Core — ARM® Cortex®‑A53 single core, 64‑bit, operating at 600 MHz.
  • Caches and SIMD — ECC‑protected 32 KB L1 instruction and data caches and 256 KB coherent L2 cache; NEON SIMD and dual‑precision FPU included.
  • Memory — DDR3L memory controller support; memory subsystem designed for embedded DDR3L devices.
  • Networking and Storage — Dual Gigabit Ethernet ports and one SATA 6 Gbps port for networking and storage connectivity.
  • High‑speed I/O — Three‑lane 6 GHz multi‑protocol SerDes supporting high‑speed interfaces and a DMA‑controlled PCIe Gen2 port; dual USB controllers with one SuperSpeed USB 3.0 controller including integrated PHY and one USB 2.0 controller.
  • Packet Acceleration — Hardware packet forwarding engine (PFE) to offload IP packet processing and improve forwarding throughput.
  • Security — Secure Boot and Arm TrustZone® for platform trust and device integrity.
  • Package and Mounting — 211‑FCLGA (9.6 × 9.6 mm) surface‑mount package suitable for compact, fanless designs.
  • Industrial Qualification & Temperature — Industrial qualification with an operating temperature range of −40 °C to 105 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Trust‑enabled IoT Gateways — Secure edge processing and trusted boot for gateway devices in industrial and commercial IoT networks.
  • Consumer and Mobile NAS — Compact network‑attached storage designs and battery‑powered mobile NAS leveraging SATA 6 Gbps and Gigabit Ethernet.
  • Entry‑level Broadband Gateways — Broadband and home gateway platforms using integrated GbE and hardware packet forwarding for efficient throughput.
  • Ethernet Drives and Data Storage — Ethernet‑attached storage and drives requiring integrated networking, SATA storage, and efficient packet handling.
  • Building and Factory Automation — Industrial controllers and automation edge nodes benefiting from industrial temp range, security features and robust I/O.

Unique Advantages

  • Compact, system‑level integration: Single‑chip solution with CPU, memory controller, SerDes, GbE and SATA reduces BOM and board area for small form factor designs.
  • Power‑efficient operation: Designed for fanless applications with low overall power draw suitable for embedded and mobile NAS use cases.
  • Hardware packet offload: Packet Forwarding Engine (PFE) offloads IP packet processing from the core, increasing throughput while lowering CPU load.
  • Built‑in security: Secure Boot and TrustZone® support help protect platform integrity from device start‑up through runtime.
  • Industrial readiness: Industrial qualification and −40 °C to 105 °C operating range enable deployment in demanding environments.
  • SuperSpeed USB with integrated PHY: On‑chip USB 3.0 controller with PHY simplifies high‑speed peripheral and storage connectivity.

Why Choose LS1012AXN7EKA?

The LS1012AXN7EKA blends ARM® Cortex®‑A53 processing, integrated I/O and hardware security into a small, industrial‑grade package tailored for embedded networking, storage and IoT gateway applications. Its combination of DDR3L memory support, dual GbE, SATA 6 Gbps, and hardware packet acceleration enables efficient, compact designs that prioritize throughput and platform integrity.

This device is well suited for engineers developing compact, fanless systems that require industrial temperature capability, security features and a simplified BOM. Backed by NXP Layerscape family enablement, it supports streamlined development and long‑term deployment needs.

Request a quote or submit an inquiry to get pricing, availability and assistance integrating the LS1012AXN7EKA into your next embedded networking or storage design.

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