UCD0J101MCL1GS

The UCD0J101MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount applications. It delivers 100 µF at 6.3 V in a compact φ6.3 × 5.8 mm can, optimized for high-density PCBs and automated assembly.

With AEC-Q200 qualification, a wide temperature range and defined endurance at elevated temperature, this capacitor targets demanding applications that require compact SMD bulk capacitance with predictable electrical performance.

Key Features

• Capacitance & Voltage — 100 µF nominal capacitance with a rated voltage of 6.3 V and capacitance tolerance of -20% to +20%.
• Low Impedance Chip Type — Chip-type construction optimized for low impedance; specified impedance of 360 mΩ supports effective decoupling in compact SMD designs.
• Temperature Range & Endurance — Rated for operation from -55°C to +105°C with endurance specified as 2000 hours at 105°C.
• Ripple Current Performance — Low-frequency ripple current 120 mA (120 Hz) and high-frequency ripple current 240 mA (10 kHz) for handling AC stress across frequencies.
• Loss and Leakage — Tangent of loss angle (tanδ) 0.26 measured at 20°C/120 Hz and a leakage current specified at 6.3 µA, enabling predictable loss and standby current characteristics.
• Surface-Mount Package — Compact φ6.3 × 5.8 mm radial can for SMD placement; surface-mount land size recommended 6.6 × 6.6 mm. Supplied in embossed carrier taping for automatic mounting.
• Qualification & Compliance — AEC-Q200 rating and RoHS compliance for use in regulated and reliability-focused designs.

Typical Applications

• Automotive Electronics — Engineered for automotive applications requiring an AEC-Q200-qualified SMD capacitor for bulk energy storage and decoupling on compact boards.
• High-density PCB Assemblies — Suited for surface mounting on high-density PCBs where space-constrained chip-type capacitors are required.
• Automated Assembly Lines — Packaged in embossed carrier taping for compatibility with automatic mounting equipment and high-volume production workflows.

Unique Advantages

• Compact low-impedance solution: The chip-type φ6.3 × 5.8 mm package delivers 100 µF with a measured impedance of 360 mΩ, enabling effective decoupling in small form-factor designs.
• Designed for high-temperature endurance: Rated to operate to +105°C with a 2000-hour endurance specification at 105°C, supporting long-term performance under elevated temperature stress.
• Frequency-flexible ripple handling: Defined ripple current ratings at both 120 Hz and 10 kHz allow designers to assess AC performance across low and high frequency conditions.
• Manufacturing-ready packaging: Embossed carrier taping and SMD compatibility simplify placement by automated assembly machines, reducing handling steps during production.
• Industry qualification: AEC-Q200 rating and RoHS compliance support regulated, reliability-focused projects and procurement requirements.

Why Choose UCD0J101MCL1GS?

The UCD0J101MCL1GS balances compact SMD packaging with the electrical performance needed for demanding, space-constrained designs. Its low-impedance chip construction, defined ripple current ratings, and measured impedance make it straightforward to specify for decoupling and bulk capacitance on high-density boards.

With AEC-Q200 qualification, wide operating temperature range (-55°C to +105°C) and packaging optimized for automated placement, this part is suited to engineering teams and procurement organizations needing a reliable, production-ready SMD aluminum electrolytic capacitor.

Request a quote or submit an RFQ for UCD0J101MCL1GS to obtain pricing, availability and lead-time information for your design and production needs.