UCD0J151MCL1GS

The UCD0J151MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface-mount use on high-density PC boards. It combines a compact φ6.3×5.8 mm SMD can with electrical characteristics targeted for power decoupling and filtering in demanding temperature environments.

With a rated voltage of 6.3 V, 150 µF capacitance, AEC-Q200 qualification and a temperature range of -55 °C to 105 °C, this part addresses automotive and other high-reliability applications where long life, low impedance and automated assembly compatibility are required.

Key Features

• Capacitance & Voltage: 150 µF nominal capacitance with a rated voltage of 6.3 V and tolerance of −20% to +20% for predictable energy storage and decoupling.
• Low Impedance Performance: Rated impedance of 360 mΩ and tan δ (DF) of 0.26 measured at 20 °C, 120 Hz, enabling effective ripple attenuation in compact designs.
• Ripple Current Capability: Low-frequency ripple current 120 mA (120 Hz) and high-frequency ripple current 240 mA (10 kHz) to support a range of switching and power-supply conditions.
• Leakage Current: Leakage current specified at 9.45 µA, supporting steady-state performance in bias circuits.
• Thermal & Endurance Ratings: Operating temperature range −55 °C to 105 °C with a rated endurance of 2000 hours at 105 °C.
• Package & Assembly: Chip-type SMD can (φ6.3×5.8 mm) with surface-mount land size 6.6 × 6.6 mm and supplied in embossed carrier taping for automatic mounting machines.
• Quality & Compliance: AEC-Q200 qualified and RoHS compliant, suited for regulated environments and high-reliability programs.
• Production Status: Available in mass production for volume manufacturing needs.

Typical Applications

• Automotive electronic modules — Suitable for use in automotive electronics where AEC-Q200 qualification and a wide temperature range are required for stable power decoupling.
• High-density surface-mount power decoupling — Compact chip form factor and low impedance make it appropriate for decoupling on space-constrained PCBs.
• Automated assembly environments — Embossed carrier taping and SMD package support high-volume pick-and-place manufacturing processes.

Unique Advantages

• Compact low-impedance solution: φ6.3×5.8 mm chip package with 360 mΩ impedance supports effective decoupling in small form-factor boards.
• Designed for thermal endurance: Rated for operation to 105 °C and specified for 2000 hours at 105 °C, enabling use in elevated-temperature applications.
• Dual-frequency ripple handling: Specified ripple currents at both 120 Hz and 10 kHz accommodate both low- and high-frequency power ripple conditions.
• Automotive-ready qualification: AEC-Q200 qualification provides a documented reliability baseline for automotive and similarly demanding programs.
• Manufacturing-friendly packaging: Embossed carrier taping and SMD form factor streamline automated placement and reduce assembly handling.

Why Choose UCD0J151MCL1GS?

The UCD0J151MCL1GS positions itself as a compact, low-impedance aluminum electrolytic capacitor engineered for surface-mount applications that demand thermal endurance and reliable decoupling. Its combination of 150 µF capacitance, 6.3 V rating, measurable low-frequency and high-frequency ripple performance, and AEC-Q200 qualification make it suitable for engineers specifying components for automotive modules and other high-reliability designs.

Designed for automated assembly and supplied in embossed carrier taping, this part supports volume manufacturing while delivering the electrical and thermal characteristics required for stable power delivery over the product life.

Request a quote or submit an inquiry to receive pricing and availability information for UCD0J151MCL1GS and to discuss how it fits your application requirements.