UCD0J220MCL1GS

The UCD0J220MCL1GS is a surface-mount, chip-type aluminum electrolytic capacitor engineered for low-impedance applications. With a rated capacitance of 22 µF at 6.3 V and a compact φ4 × 5.8 mm can, it is designed for high-density PCB assembly and automated placement.

Key value propositions include low impedance and controlled loss (tanδ), AEC-Q200 qualification for demanding environments, and a temperature range that supports operation from −55°C to 105°C.

Key Features

• Capacitance & Voltage — 22 µF rated capacitance at 6.3 V with tolerance −20% to +20% (measured at 120 Hz, 20°C).
• Low Impedance Performance — Specified impedance of 1.35 Ω and a tangent of loss angle (tanδ) up to 0.26 at 20°C, 120 Hz, supporting stable filtering and decoupling.
• Ripple Current Ratings — Low-frequency ripple current 45 mA at 120 Hz and high-frequency ripple current 90 mA at 10 kHz for mixed-frequency noise suppression.
• Leakage Current — Low leakage current specified at 3 µA, supporting low-standby-loss applications.
• Automotive-Grade Reliability — AEC-Q200 qualified, with endurance specified to 2000 hours at 105°C for applications requiring elevated-temperature durability.
• Wide Temperature Range — Operates from −55°C to 105°C, enabling use across broad thermal environments.
• Compact SMD Can Package — Chip-type radial can (SMD) with dimensions φ4 × 5.8 mm and recommended land pattern 4.3 × 4.3 mm for high-density boards.
• Assembly Ready — Supplied on embossed carrier tape for automatic mounting machines.
• RoHS Compliant — Conforms to RoHS requirements for regulated environments.

Typical Applications

• Automotive Electronics — Suitable for electronic control modules and onboard systems where AEC-Q200 qualification and 105°C endurance are required.
• Power Supply Filtering — Effective for bulk decoupling and ripple suppression in compact DC–DC converters and local power rails.
• High-Density PCB Assemblies — Chip-type SMD can and embossed tape packaging facilitate automated placement in space-constrained designs.

Unique Advantages

• Compact footprint with can-style robustness: φ4 × 5.8 mm SMD can delivers aluminum electrolytic capacitance in a small, board-friendly package.
• Low-impedance and controlled loss: 1.35 Ω impedance and tanδ 0.26 (120 Hz, 20°C) help maintain stable filtering performance across temperature.
• Designed for mixed-frequency ripple: Defined ripple currents at 120 Hz and 10 kHz support both low- and high-frequency noise mitigation.
• Automated assembly compatible: Embossed carrier tape packaging enables efficient pick-and-place for high-volume production.
• High-temperature endurance: Rated for operation to 105°C with a 2000-hour endurance specification at that temperature for reliability in elevated-heat environments.
• Standby efficiency: Low leakage current (3 µA) reduces quiescent losses in low-power and standby systems.

Why Choose UCD0J220MCL1GS?

UCD0J220MCL1GS positions itself as a compact, low-impedance aluminum electrolytic solution for designers who need reliable bulk capacitance in space-constrained, surface-mount layouts. Its combination of defined ripple handling, low leakage, and AEC-Q200 qualification makes it appropriate for demanding assemblies that require long-term performance at elevated temperatures.

This part is suited to engineers and buyers specifying components for automotive-grade electronics, compact power supplies, and dense PCB designs where automated assembly and RoHS compliance are required. The clear, spec-driven performance parameters make it straightforward to evaluate for design and procurement decisions.

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